E. Ercan Alp

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Naperville, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Redundantly constrained laminar structure as weak-link mechanisms
- Patent number 6,984,335
- Issue date Jan 10, 2006
- The University of Chicago
- Deming Shu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Redundantly constrained laminar structure as weak-link mechanisms
- Patent number 6,607,840
- Issue date Aug 19, 2003
- The University of Chicago
- Deming Shu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Redundantly constrained laminar structure as weak-link mechanisms
- Publication number 20040013898
- Publication date Jan 22, 2004
- The University of Chicago
- Deming Shu
- B32 - LAYERED PRODUCTS
Information Patent Application
Redundantly constrained laminar structure as weak-link mechanisms
- Publication number 20020060200
- Publication date May 23, 2002
- The University of Chicago
- Deming Shu
- B32 - LAYERED PRODUCTS