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E-Tung Chou
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Hsin-Chu City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Apparatus and methods for controlling a laser output and improving...
Patent number
8,847,161
Issue date
Sep 30, 2014
Magnolia Source (Cayman) Limited
Yung Cheng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor package substrate
Patent number
7,399,399
Issue date
Jul 15, 2008
Phoenix Precision Technology Corporation
E-Tung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package substrate having bonding pads with plated lay...
Patent number
7,396,753
Issue date
Jul 8, 2008
Phoenix Precision Technology Corporation
Chih-Liang Chu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Apparatus and Methods for Controlling a Laser Output and Improving...
Publication number
20130168551
Publication date
Jul 4, 2013
Yung Cheng CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing circuit board for semiconductor package
Publication number
20070087587
Publication date
Apr 19, 2007
Ming Yeh Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for manufacturing semiconductor package substrate
Publication number
20070087473
Publication date
Apr 19, 2007
E-Tung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Substrate structure of semiconductor package
Publication number
20060273458
Publication date
Dec 7, 2006
Wen-Shien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit board structure and method for fabricating the same
Publication number
20060243482
Publication date
Nov 2, 2006
E-Tung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for fabricating interlayer conducting structure of circuit b...
Publication number
20060237389
Publication date
Oct 26, 2006
E-Tung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor package substrate having bonding pads with plated lay...
Publication number
20060006422
Publication date
Jan 12, 2006
Chih-Liang Chu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor package substrate having bonding pads with plated lay...
Publication number
20040099961
Publication date
May 27, 2004
Chih-Liang Chu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR