Ebin Liao

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level package and a method of forming a wafer level package
- Patent number 8,729,695
- Issue date May 20, 2014
- Agency for Science, Technology and Research
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system
- Patent number 8,174,342
- Issue date May 8, 2012
- STMicroelectronics N.V.
- Tang Min
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Forming a Bonded Structure
- Publication number 20130037603
- Publication date Feb 14, 2013
- AGENCY FOR SCIENCE ,TECHNOLOGY AND RESEARCH
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and a Method of Forming a Wafer Level Package
- Publication number 20130020713
- Publication date Jan 24, 2013
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME
- Publication number 20100187682
- Publication date Jul 29, 2010
- Damaruganath Pinjala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEM
- Publication number 20100171575
- Publication date Jul 8, 2010
- STMicroelectronics Asia Pacific Pte. Ltd.
- Tang Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRAINING A SEMICONDUCTOR WAFER AND A WAFER SUBSTRATE UN...
- Publication number 20100052064
- Publication date Mar 4, 2010
- Agency for Science, Technology and Research
- Guo-Qiang Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for micro component self-assembly
- Publication number 20090116207
- Publication date May 7, 2009
- Samuel Long Yak Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planar microspring integrated circuit chip interconnection to next...
- Publication number 20060197232
- Publication date Sep 7, 2006
- National University of Singapore
- Andrew Ah Ong Tay
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wafer level package and a method of forming a wafer level package

Microelectromechanical system

Patents Applicationslast 30 patents

Method of Forming a Bonded Structure

Wafer Level Package and a Method of Forming a Wafer Level Package

ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME

MICROELECTROMECHANICAL SYSTEM

METHOD FOR STRAINING A SEMICONDUCTOR WAFER AND A WAFER SUBSTRATE UN...

Method for micro component self-assembly

Planar microspring integrated circuit chip interconnection to next...