Ebin LIAO

Person

Xinzhu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,672
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through-silicon vias
- Patent number 11,545,392
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of bonding substrates
- Patent number 10,872,874
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B30 - PRESSES
Information Patent Grant
Method and apparatus for bonding semiconductor devices
- Patent number 10,867,831
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor component having through-silicon vias
- Patent number 10,784,162
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding semiconductor devices
- Patent number 10,748,803
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and capacitors
- Patent number 10,727,294
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structure and method of manufa...
- Patent number 10,672,737
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding semiconductor devices
- Patent number 10,269,611
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through-silicon vias and method of m...
- Patent number 10,115,634
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and capacitors
- Patent number 9,899,467
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a device having a capped through-substrate via...
- Patent number 9,847,256
- Issue date Dec 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with capped through-substrate via structure
- Patent number 9,514,986
- Issue date Dec 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through-silicon vias and method of m...
- Patent number 9,418,923
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via structures and methods of forming the same
- Patent number 9,263,382
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with through-silicon via (TSV) and method of forming the same
- Patent number 9,087,878
- Issue date Jul 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via structures and methods of forming the same
- Patent number 8,803,322
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon vias for semicondcutor substrate and method of manu...
- Patent number 8,575,725
- Issue date Nov 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with through-silicon via (TSV) and method of forming the same
- Patent number 8,525,343
- Issue date Sep 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon vias for semicondcutor substrate and method of manu...
- Patent number 8,487,410
- Issue date Jul 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240347506
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS
- Publication number 20210005515
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Bonding Semiconductor Devices
- Publication number 20200373185
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200294966
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF BONDING SUBSTRATES
- Publication number 20190267347
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Bonding Semiconductor Devices
- Publication number 20190244851
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...
- Publication number 20190139935
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS
- Publication number 20190067107
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Capacitors
- Publication number 20180175137
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device with Through-Substrate Via Structure and Method for Forming...
- Publication number 20170084489
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF M...
- Publication number 20160329245
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Capacitors
- Publication number 20150162397
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device with Through-Substrate Via Structure and Method for Forming...
- Publication number 20150061147
- Publication date Mar 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20140327151
- Publication date Nov 6, 2014
- Ku-Feng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF M...
- Publication number 20140015146
- Publication date Jan 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH THROUGH-SILICON VIA (TSV) AND METHOD OF FORMING THE SAME
- Publication number 20130323883
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANU...
- Publication number 20130193578
- Publication date Aug 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20130093098
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANU...
- Publication number 20120261827
- Publication date Oct 18, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH THROUGH-SILICON VIA (TSV) AND METHOD OF FORMING THE SAME
- Publication number 20120074582
- Publication date Mar 29, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package structure and method of forming the same

Semiconductor component having through-silicon vias

Bonding apparatus and method of bonding substrates

Method and apparatus for bonding semiconductor devices

Method of making a semiconductor component having through-silicon vias

Method and apparatus for bonding semiconductor devices

Semiconductor devices, methods of manufacture thereof, and capacitors

Three-dimensional integrated circuit structure and method of manufa...

Method and apparatus for bonding semiconductor devices

Semiconductor component having through-silicon vias and method of m...

Semiconductor devices, methods of manufacture thereof, and capacitors

Methods for forming a device having a capped through-substrate via...

Device with capped through-substrate via structure

Semiconductor component having through-silicon vias and method of m...

Through substrate via structures and methods of forming the same

Device with through-silicon via (TSV) and method of forming the same

Through substrate via structures and methods of forming the same

Through-silicon vias for semicondcutor substrate and method of manu...

Device with through-silicon via (TSV) and method of forming the same

Through-silicon vias for semicondcutor substrate and method of manu...

Patents Applicationslast 30 patents

METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS

Method and Apparatus for Bonding Semiconductor Devices

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

BONDING APPARATUS AND METHOD OF BONDING SUBSTRATES

Method and Apparatus for Bonding Semiconductor Devices

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...

METHOD OF MAKING A SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS

Semiconductor Devices, Methods of Manufacture Thereof, and Capacitors

Device with Through-Substrate Via Structure and Method for Forming...

SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF M...

Semiconductor Devices, Methods of Manufacture Thereof, and Capacitors

Device with Through-Substrate Via Structure and Method for Forming...

THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR COMPONENT HAVING THROUGH-SILICON VIAS AND METHOD OF M...

DEVICE WITH THROUGH-SILICON VIA (TSV) AND METHOD OF FORMING THE SAME

THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANU...

THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME

THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANU...

DEVICE WITH THROUGH-SILICON VIA (TSV) AND METHOD OF FORMING THE SAME