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Eckart Bergmann
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Jena, DE
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last 30 patents
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Patent Grant
Method for exposing a layout comprising multiple layers on a wafer
Patent number
6,635,395
Issue date
Oct 21, 2003
Leica Microsystems Lithography GmbH
Peter Hahmann
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Method for exposing a layout comprising multiple layers on a wafer
Publication number
20020039828
Publication date
Apr 4, 2002
LEICA MICROSYSTEMS LITHOGRAPHY GmbH
Peter Hahmann
B82 - NANO-TECHNOLOGY