Eckhard DITZEL

Person

Linsengericht, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a connection support, connection support and op...
- Patent number 10,468,569
- Issue date Nov 5, 2019
- Osram Opto Semiconductor GmbH
- Jörg Erich Sorg
- B32 - LAYERED PRODUCTS
Information Patent Grant
Strip-type substrate for producing chip card modules
- Patent number 10,176,420
- Issue date Jan 8, 2019
- Heraeus Deutschland GmbH & Co. KG
- Eckhard Ditzel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Strip-shaped substrate for producing chip carriers, electronic modu...
- Patent number 9,941,197
- Issue date Apr 10, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eckhard Ditzel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip-integrated through-plating of multi-layer substrates
- Patent number 9,756,730
- Issue date Sep 5, 2017
- Osram Opto Semiconductors GmbH
- Andreas Steffen Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component
- Patent number 9,048,393
- Issue date Jun 2, 2015
- Osram Opto Semiconductor GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated substrates for mounting electronic parts and methods for...
- Patent number 8,153,232
- Issue date Apr 10, 2012
- W. C. Heraeus GmbH
- Eckhard Ditzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Connection Carrier, Optoelectronic Component and Method for Produci...
- Publication number 20190097106
- Publication date Mar 28, 2019
- Osram Opto Semiconductors GmbH
- Eckhard Ditzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A CONNECTION SUPPORT, CONNECTION SUPPORT AND OP...
- Publication number 20180138379
- Publication date May 17, 2018
- Jörg Erich Sorg
- B32 - LAYERED PRODUCTS
Information Patent Application
STRIP-TYPE SUBSTRATE FOR PRODUCING CHIP CARD MODULES
- Publication number 20180039875
- Publication date Feb 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eckhard DITZEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODU...
- Publication number 20170133313
- Publication date May 11, 2017
- Heraeus Deutschland GmbH & Co. KG
- Eckhard DITZEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES
- Publication number 20130223032
- Publication date Aug 29, 2013
- Osram Opto Semiconductors GmbH
- Andreas Steffen Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT
- Publication number 20130215584
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Andreas Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT
- Publication number 20120139003
- Publication date Jun 7, 2012
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED SUBSTRATES FOR MOUNTING ELECTRONIC PARTS AND METHODS FOR...
- Publication number 20080220202
- Publication date Sep 11, 2008
- W.C. Heraeus GmbH
- Eckhard DITZEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Eckhard DITZEL

Person

Patents Grantslast 30 patents

Method of producing a connection support, connection support and op...

Strip-type substrate for producing chip card modules

Strip-shaped substrate for producing chip carriers, electronic modu...

Chip-integrated through-plating of multi-layer substrates

Optoelectronic component

Laminated substrates for mounting electronic parts and methods for...

Patents Applicationslast 30 patents

Connection Carrier, Optoelectronic Component and Method for Produci...

METHOD OF PRODUCING A CONNECTION SUPPORT, CONNECTION SUPPORT AND OP...

STRIP-TYPE SUBSTRATE FOR PRODUCING CHIP CARD MODULES

STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODU...

CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES

LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT

OPTOELECTRONIC COMPONENT

LAMINATED SUBSTRATES FOR MOUNTING ELECTRONIC PARTS AND METHODS FOR...