Eckhard Langer

Person

Radebeul, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Technique for forming metal lines in a semiconductor by adapting th...
- Patent number 8,575,029
- Issue date Nov 5, 2013
- Advanced Micro Devices, Inc.
- Moritz Andreas Meyer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming an alloy in an interconnect structure to increase...
- Patent number 8,329,577
- Issue date Dec 11, 2012
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for monitoring dynamic processes in metal lines of micros...
- Patent number 8,118,932
- Issue date Feb 21, 2012
- Advanced Micro Devices, Inc.
- Joerg Buschbeck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of testing an integrity of a material layer in a semiconduct...
- Patent number 8,058,081
- Issue date Nov 15, 2011
- Advanced Micro Devices, Inc.
- Moritz Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming metal lines in a semiconductor by adapting th...
- Patent number 8,058,731
- Issue date Nov 15, 2011
- Advanced Micro Devices, Inc.
- Moritz Andreas Meyer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Technique for increasing adhesion of metallization layers by provid...
- Patent number 7,611,991
- Issue date Nov 3, 2009
- Advanced Micro Devices, Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for CD measurement on the basis of area fraction determin...
- Patent number 7,335,880
- Issue date Feb 26, 2008
- Advanced Micro Devices, Inc.
- Eckhard Langer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure comprising a stress sensitive element and m...
- Patent number 7,311,008
- Issue date Dec 25, 2007
- Advanced Micro Devices, Inc.
- Eckhard Langer
- G01 - MEASURING TESTING
Information Patent Grant
Technique for monitoring the state of metal lines in microstructures
- Patent number 6,953,755
- Issue date Oct 11, 2005
- Advanced Micro Devices, Inc.
- Moritz Andreas Meyer
- G01 - MEASURING TESTING
Information Patent Grant
Interface void monitoring in a damascene process
- Patent number 6,716,650
- Issue date Apr 6, 2004
- Advanced Micro Devices, Inc.
- Eckhard Langer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUE FOR FORMING METAL LINES IN A SEMICONDUCTOR BY ADAPTING TH...
- Publication number 20120088365
- Publication date Apr 12, 2012
- Advanced Micro Devices, Inc.
- Moritz Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increasing Electromigration Resistance in an Interconnect Structure...
- Publication number 20110124189
- Publication date May 26, 2011
- GLOBALFOUNDRIES INC.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING ELECTROMIGRATION RESISTANCE IN AN INTERCONNECT STRUCTURE...
- Publication number 20090197408
- Publication date Aug 6, 2009
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR FORMING METAL LINES IN A SEMICONDUCTOR BY ADAPTING TH...
- Publication number 20080268265
- Publication date Oct 30, 2008
- Moritz Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING AN INTEGRITY OF A MATERIAL LAYER IN A SEMICONDUCT...
- Publication number 20080160654
- Publication date Jul 3, 2008
- Moritz Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR INCREASING ADHESION OF METALLIZATION LAYERS BY PROVID...
- Publication number 20070123009
- Publication date May 31, 2007
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR MONITORING DYNAMIC PROCESSES IN METAL LINES OF MICROS...
- Publication number 20070044710
- Publication date Mar 1, 2007
- JOERG BUSCHBECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for CD measurement on the basis of area fraction determin...
- Publication number 20060219906
- Publication date Oct 5, 2006
- Eckhard Langer
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor structure comprising a stress sensitive element and m...
- Publication number 20050263760
- Publication date Dec 1, 2005
- Eckhard Langer
- G01 - MEASURING TESTING
Information Patent Application
Technique for monitoring the state of metal lines in microstructures
- Publication number 20050072919
- Publication date Apr 7, 2005
- Moritz Andreas Meyer
- G01 - MEASURING TESTING

Eckhard Langer

Person

Patents Grantslast 30 patents

Technique for forming metal lines in a semiconductor by adapting th...

Method of forming an alloy in an interconnect structure to increase...

Technique for monitoring dynamic processes in metal lines of micros...

Method of testing an integrity of a material layer in a semiconduct...

Technique for forming metal lines in a semiconductor by adapting th...

Technique for increasing adhesion of metallization layers by provid...

Technique for CD measurement on the basis of area fraction determin...

Semiconductor structure comprising a stress sensitive element and m...

Technique for monitoring the state of metal lines in microstructures

Interface void monitoring in a damascene process

Patents Applicationslast 30 patents

TECHNIQUE FOR FORMING METAL LINES IN A SEMICONDUCTOR BY ADAPTING TH...

Increasing Electromigration Resistance in an Interconnect Structure...

INCREASING ELECTROMIGRATION RESISTANCE IN AN INTERCONNECT STRUCTURE...

TECHNIQUE FOR FORMING METAL LINES IN A SEMICONDUCTOR BY ADAPTING TH...

METHOD OF TESTING AN INTEGRITY OF A MATERIAL LAYER IN A SEMICONDUCT...

TECHNIQUE FOR INCREASING ADHESION OF METALLIZATION LAYERS BY PROVID...

TECHNIQUE FOR MONITORING DYNAMIC PROCESSES IN METAL LINES OF MICROS...

Technique for CD measurement on the basis of area fraction determin...

Semiconductor structure comprising a stress sensitive element and m...

Technique for monitoring the state of metal lines in microstructures