Eddie Acosta

Person

Martindale, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to form a via
- Patent number 8,586,474
- Issue date Nov 19, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnects for 3-D applications
- Patent number 8,003,517
- Issue date Aug 23, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a via
- Patent number 7,932,175
- Issue date Apr 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropad formation for a semiconductor
- Patent number 7,807,572
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropad for bonding and a method therefor
- Patent number 7,572,723
- Issue date Aug 11, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device having a diffusion barrier...
- Patent number 7,422,979
- Issue date Sep 9, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Lynne M. Michaelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning electroless process tank
- Patent number 7,410,544
- Issue date Aug 12, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Sam S. Garcia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO FORM A VIA
- Publication number 20110151663
- Publication date Jun 23, 2011
- Freescale Semiconductor Inc.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPAD FORMATION FOR A SEMICONDUCTOR
- Publication number 20090176366
- Publication date Jul 9, 2009
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming interconnects for 3-D applications
- Publication number 20080299762
- Publication date Dec 4, 2008
- Freescale Semiconductor, Inc.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to form a via
- Publication number 20080299759
- Publication date Dec 4, 2008
- Freescale Semiconductor, Inc.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPAD FOR BONDING AND A METHOD THEREFOR
- Publication number 20080099799
- Publication date May 1, 2008
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning electroless process tank
- Publication number 20070246075
- Publication date Oct 25, 2007
- Freescale Semiconductor, Inc.
- Sam S. Garcia
- B08 - CLEANING
Information Patent Application
Method and composition for preparing a semiconductor surface for de...
- Publication number 20060270234
- Publication date Nov 30, 2006
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a semiconductor device having a diffusion barrier...
- Publication number 20060202339
- Publication date Sep 14, 2006
- Lynne M. Michaelson
- H01 - BASIC ELECTRIC ELEMENTS

Eddie Acosta

Person

Patents Grantslast 30 patents

Method to form a via

Method for forming interconnects for 3-D applications

Method to form a via

Micropad formation for a semiconductor

Micropad for bonding and a method therefor

Method of forming a semiconductor device having a diffusion barrier...

Method for cleaning electroless process tank

Patents Applicationslast 30 patents

METHOD TO FORM A VIA

MICROPAD FORMATION FOR A SEMICONDUCTOR

Method for forming interconnects for 3-D applications

Method to form a via

MICROPAD FOR BONDING AND A METHOD THEREFOR

Method for cleaning electroless process tank

Method and composition for preparing a semiconductor surface for de...

Method of forming a semiconductor device having a diffusion barrier...