Eddy Roelants

Person

Asse, BE

People

Patents Grantslast 30 patents

Information Patent Grant
Arrangement and method for processing electrical substrates using l...
- Patent number 6,849,823
- Issue date Feb 1, 2005
- Siemens Aktiengesellschaft
- Sebastien Edme
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser processing
- Patent number 6,833,528
- Issue date Dec 21, 2004
- Siemens Aktiengesellschaft
- Hubert De Steur
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for structuring printed circuit boards
- Patent number 6,783,688
- Issue date Aug 31, 2004
- Siemens Aktiengesellschaft
- Hubert De Steur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for drilling holes in a substrate
- Patent number 6,781,092
- Issue date Aug 24, 2004
- Siemens Aktiengesellschaft
- Hubert De Steur
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of calibrating the optical system of a laser machine for pro...
- Patent number 6,678,061
- Issue date Jan 13, 2004
- Siemens Aktiengesellschaft
- Alexander Kilthau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of laser drilling
- Patent number 6,649,864
- Issue date Nov 18, 2003
- Siemens Aktiengesellschaft
- Hubert De Steur
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for drilling micro-holes with a laser beam
- Patent number 6,610,960
- Issue date Aug 26, 2003
- Siemens Aktiengesellschaft
- Hubert De Steur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wiring configurations having coarse conductor...
- Patent number 6,576,402
- Issue date Jun 10, 2003
- Siemens Production & Logistics Systems AG
- Marcel Heerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the laser machining of organic materials
- Patent number 6,531,679
- Issue date Mar 11, 2003
- Siemens Aktiengesellschaft
- Marcel Heerman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for processing substrates
- Patent number 6,437,283
- Issue date Aug 20, 2002
- Siemens Aktiengesellschaft
- Udo Wiggermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying a solder resist layer to a printed circuit board
- Patent number 5,134,056
- Issue date Jul 28, 1992
- Siemens Aktiengesellschaft
- Hans-Fr. Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Arrangement and method for processing electrical substrates using l...
- Publication number 20040164057
- Publication date Aug 26, 2004
- Sebastien Edme
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for drilling holes in a substrate
- Publication number 20030201260
- Publication date Oct 30, 2003
- Hubert De Steur
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for laser processing
- Publication number 20030168435
- Publication date Sep 11, 2003
- Hubert De Steur
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of laser drilling
- Publication number 20030047544
- Publication date Mar 13, 2003
- Hubert De Steur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of calibrating the optical system of a laser machine for pro...
- Publication number 20030002055
- Publication date Jan 2, 2003
- Alexander Kilthau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for structuring printed circuit borads
- Publication number 20030000916
- Publication date Jan 2, 2003
- Hubert De Steur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for drilling micro-holes with a laser beam
- Publication number 20020190037
- Publication date Dec 19, 2002
- Hubert De Steur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing wiring configurations having coarse conductor...
- Publication number 20020110752
- Publication date Aug 15, 2002
- Marcel Heerman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
DEVICE AND METHOD FOR PROCESSING SUBSTRATES
- Publication number 20020063113
- Publication date May 30, 2002
- Udo Wiggermann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the laser machining of organic materials
- Publication number 20020060209
- Publication date May 23, 2002
- Marcel Heerman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Eddy Roelants

Person

Patents Grantslast 30 patents

Arrangement and method for processing electrical substrates using l...

Method and apparatus for laser processing

Method and apparatus for structuring printed circuit boards

Method for drilling holes in a substrate

Method of calibrating the optical system of a laser machine for pro...

Method of laser drilling

Method for drilling micro-holes with a laser beam

Method for producing wiring configurations having coarse conductor...

Method for the laser machining of organic materials

Device and method for processing substrates

Method for applying a solder resist layer to a printed circuit board

Patents Applicationslast 30 patents

Arrangement and method for processing electrical substrates using l...

Method for drilling holes in a substrate

Method and apparatus for laser processing

Method of laser drilling

Method of calibrating the optical system of a laser machine for pro...

Method and apparatus for structuring printed circuit borads

Method for drilling micro-holes with a laser beam

Method for producing wiring configurations having coarse conductor...

DEVICE AND METHOD FOR PROCESSING SUBSTRATES

Method for the laser machining of organic materials