Eddy Tjhia

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 8,598,035
- Issue date Dec 3, 2013
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 8,193,043
- Issue date Jun 5, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die structures for wafer-level chipscale packaging of...
- Patent number 8,058,732
- Issue date Nov 15, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 7,960,800
- Issue date Jun 14, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 7,800,219
- Issue date Sep 21, 2010
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical structure for semiconductor wafer-level chip scale packages
- Patent number 6,392,290
- Issue date May 21, 2002
- Siliconix Incorporated
- Y. Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...
- Publication number 20110230046
- Publication date Sep 22, 2011
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAP...
- Publication number 20110059580
- Publication date Mar 10, 2011
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Dice with Backside Trenches Filled With Elastic Mater...
- Publication number 20100148325
- Publication date Jun 17, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Structures for Wafer-Level Chipscale Packaging of...
- Publication number 20100123225
- Publication date May 20, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Power Semiconductor Die Packages With Integrated Heat-Sink Cap...
- Publication number 20090166850
- Publication date Jul 2, 2009
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS