Edmond Soon

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
System in package manufacturing method using wafer-to-wafer bonding
- Patent number 8,822,267
- Issue date Sep 2, 2014
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM IN PACKAGE MANUFACTURING METHOD USING WAFER-TO-WAFER BONDING
- Publication number 20140113410
- Publication date Apr 24, 2014
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS