Edmund Goetz

Person

Dachau, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency shielding within a semiconductor package
- Patent number 11,018,713
- Issue date May 25, 2021
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency shielding within a semiconductor package
- Patent number 10,135,481
- Issue date Nov 20, 2018
- Intel IP Corporation
- Edmund Goetz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of forming stacked microelectronic dice embedded in a micro...
- Patent number 9,564,400
- Issue date Feb 7, 2017
- Intel Corporation
- Reinhard Mahnkopf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic dice embedded in a microelectronic substrate
- Patent number 9,373,588
- Issue date Jun 21, 2016
- Intel Corporation
- Reinhard Mahnkopf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency shielding within a semiconductor package
- Patent number 9,362,233
- Issue date Jun 7, 2016
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package vias for radio frequency antenna connections
- Patent number 9,252,077
- Issue date Feb 2, 2016
- Intel Corporation
- Wolfgang Molzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frequency synthesizer with a phase-locked loop for receiving and pr...
- Patent number 6,405,024
- Issue date Jun 11, 2002
- Siemens Aktiengesellschaft
- Edmund Goetz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit configuration for generating even-numbered duty factors
- Patent number 5,524,037
- Issue date Jun 4, 1996
- Siemens Aktiengesellschaft
- Gunter Donig
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
- Publication number 20210281286
- Publication date Sep 9, 2021
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
- Publication number 20190052301
- Publication date Feb 14, 2019
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
- Publication number 20160359520
- Publication date Dec 8, 2016
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DICE EMBEDDED IN A MICROELECTRONIC SUBSTRATE
- Publication number 20160148920
- Publication date May 26, 2016
- Intel Corporation
- Reinhard Mahnkopf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DICE EMBEDDED IN A MICROELECTRONIC SUBSTRATE
- Publication number 20150084165
- Publication date Mar 26, 2015
- Reinhard Mahnkopf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE VIAS FOR RADIO FREQUENCY ANTENNA CONNECTIONS
- Publication number 20150084194
- Publication date Mar 26, 2015
- Wolfgang Molzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
- Publication number 20150001689
- Publication date Jan 1, 2015
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE LEVEL REDISTRIBUTION LAYER FOR MULTIPLE CHIP INTEGRATION
- Publication number 20150001713
- Publication date Jan 1, 2015
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS

Edmund Goetz

Person

Patents Grantslast 30 patents

Radio frequency shielding within a semiconductor package

Radio frequency shielding within a semiconductor package

Methods of forming stacked microelectronic dice embedded in a micro...

Stacked microelectronic dice embedded in a microelectronic substrate

Radio frequency shielding within a semiconductor package

Package vias for radio frequency antenna connections

Frequency synthesizer with a phase-locked loop for receiving and pr...

Circuit configuration for generating even-numbered duty factors

Patents Applicationslast 30 patents

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

STACKED MICROELECTRONIC DICE EMBEDDED IN A MICROELECTRONIC SUBSTRATE

STACKED MICROELECTRONIC DICE EMBEDDED IN A MICROELECTRONIC SUBSTRATE

PACKAGE VIAS FOR RADIO FREQUENCY ANTENNA CONNECTIONS

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

MULTIPLE LEVEL REDISTRIBUTION LAYER FOR MULTIPLE CHIP INTEGRATION