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Edmund Lua Koon Tian
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Singapore, SG
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Patents Grants
last 30 patents
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Patent Grant
Methods for assembling semiconductor devices and interposers
Patent number
7,528,007
Issue date
May 5, 2009
Micron Technology, Inc.
Setho Sing Fee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die package
Patent number
7,489,028
Issue date
Feb 10, 2009
Micron Technology, Inc.
Edmund Lua Koon Tian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposers with receptacles for receiving semiconductor devices an...
Patent number
7,274,095
Issue date
Sep 25, 2007
Micron Technology, Inc.
Setho Sing Fee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die package
Patent number
6,919,645
Issue date
Jul 19, 2005
Micron Technology, Inc.
Edmund Lua Koon Tian
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
Publication number
20120108010
Publication date
May 3, 2012
Micron Technology, Inc.
Edmund Lua Koon Tian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball grid array interposer, packages and methods
Publication number
20040217459
Publication date
Nov 4, 2004
Setho Sing Fee
H01 - BASIC ELECTRIC ELEMENTS