Edmund Lua Koon Tian

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
Die package
- Publication number 20040164410
- Publication date Aug 26, 2004
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20020142513
- Publication date Oct 3, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS