Edmund Lua Koon Tian

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Die package
- Patent number 6,825,572
- Issue date Nov 30, 2004
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array interposer, packages and methods
- Patent number 6,746,894
- Issue date Jun 8, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20090045496
- Publication date Feb 19, 2009
- Micron Technology, Inc.
- Edmund Lua Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for assembling semiconductor devices and interposers
- Publication number 20060194373
- Publication date Aug 31, 2006
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die package
- Publication number 20050253226
- Publication date Nov 17, 2005
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die package
- Publication number 20030107138
- Publication date Jun 12, 2003
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS