Edmund M. Sikorski

Person

Florida, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Etch rate enhancement for a silicon etch process through etch chamb...
- Patent number 9,711,365
- Issue date Jul 18, 2017
- International Business Machines Corporation
- Eric A. Joseph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio and reduced undercut trench etch process for a se...
- Patent number 8,928,124
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Nicholas C. M. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio and reduced undercut trench etch process for a se...
- Patent number 8,652,969
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Nicholas C. M. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced high-k gate stack patterning and structure containing a pa...
- Patent number 7,820,552
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Siva Kanakasabapathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial polysilicon sidewall process and rapid thermal spike an...
- Patent number 6,743,686
- Issue date Jun 1, 2004
- International Business Machines Corporation
- Kam Leung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial polysilicon sidewall process and rapid thermal spike an...
- Patent number 6,518,136
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Kam Leung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCH RATE ENHANCEMENT FOR A SILICON ETCH PROCESS THROUH ETCH CHAMBE...
- Publication number 20150318182
- Publication date Nov 5, 2015
- Zeon Corporation
- Eric A. Joseph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SE...
- Publication number 20130328173
- Publication date Dec 12, 2013
- Zeon Corporation
- Nicholas C. M. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SE...
- Publication number 20130105947
- Publication date May 2, 2013
- Zeon Corporation
- Nicholas C. M. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED HIGH-k GATE STACK PATTERNING AND STRUCTURE CONTAINING A PA...
- Publication number 20080224238
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Siva Kanakasabapathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial polysilicon sidewall process and rapid thermal spike an...
- Publication number 20020151145
- Publication date Oct 17, 2002
- Reel/Frame
- Kam Leung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial polysilicon sidewall process and rapid thermal spike an...
- Publication number 20020076889
- Publication date Jun 20, 2002
- Kam Leung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Edmund M. Sikorski

Person

Patents Grantslast 30 patents

Etch rate enhancement for a silicon etch process through etch chamb...

High aspect ratio and reduced undercut trench etch process for a se...

High aspect ratio and reduced undercut trench etch process for a se...

Advanced high-k gate stack patterning and structure containing a pa...

Sacrificial polysilicon sidewall process and rapid thermal spike an...

Sacrificial polysilicon sidewall process and rapid thermal spike an...

Patents Applicationslast 30 patents

ETCH RATE ENHANCEMENT FOR A SILICON ETCH PROCESS THROUH ETCH CHAMBE...

HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SE...

HIGH ASPECT RATIO AND REDUCED UNDERCUT TRENCH ETCH PROCESS FOR A SE...

ADVANCED HIGH-k GATE STACK PATTERNING AND STRUCTURE CONTAINING A PA...

Sacrificial polysilicon sidewall process and rapid thermal spike an...

Sacrificial polysilicon sidewall process and rapid thermal spike an...