Edmund Riedl

Person

Obertraubling-Gebelkofen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Inorganic encapsulant for electronic component with adhesion promoter
- Patent number 11,652,012
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a layer structure, layer structure, method of for...
- Patent number 11,328,935
- Issue date May 10, 2022
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements
- Patent number 10,930,614
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,615,145
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection member with bulk body and electrically and thermally con...
- Patent number 10,366,946
- Issue date Jul 30, 2019
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder alloys and arrangements
- Patent number 9,735,126
- Issue date Aug 15, 2017
- Infineon Technologies AG
- Manfred Mengel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 8,603,864
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package and method of assembling a semiconductor package
- Patent number 8,410,586
- Issue date Apr 2, 2013
- Infineon Technologies, AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bonding material with exothermically reactive heterostructures
- Patent number 8,177,878
- Issue date May 15, 2012
- Infineon Technologies AG
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,156,643
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing a metal article intended for at least partiall...
- Patent number 8,147,621
- Issue date Apr 3, 2012
- Infineon Technologies AG
- Edmund Riedl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package
- Patent number 7,989,930
- Issue date Aug 2, 2011
- Infineon Technologies AG
- Edmund Riedl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an integrated circuit including electrodeposition...
- Patent number 7,909,978
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device
- Patent number 7,911,061
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for the planar joining of components of semiconductor device...
- Patent number 7,874,475
- Issue date Jan 25, 2011
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldered semiconductor device
- Patent number 7,851,910
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with semiconductor device components embedded...
- Patent number 7,705,472
- Issue date Apr 27, 2010
- Infineon Technologies, AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive body including an adhesion promoter layer,...
- Patent number 7,540,950
- Issue date Jun 2, 2009
- Infineon Technologies, AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip arrangement and method
- Patent number 7,511,382
- Issue date Mar 31, 2009
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal article intended for at least partially coating with a substa...
- Patent number 7,384,698
- Issue date Jun 10, 2008
- Infineon Technologies AG
- Edmund Riedl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion solder position, and process for producing it
- Patent number 7,368,824
- Issue date May 6, 2008
- Infineon Technologies AG
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection device and method for producing the same
- Patent number 6,727,587
- Issue date Apr 27, 2004
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMEN...
- Publication number 20230274996
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package Having an Adhesion Promoter
- Publication number 20230260860
- Publication date Aug 17, 2023
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING...
- Publication number 20230064442
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Chan Whai Augustine KAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...
- Publication number 20230027669
- Publication date Jan 26, 2023
- INFINEON TECHNOLOGIES AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLE HAVING MORPHOLOGICAL ADHESION PROMOTER SHELL ON CORE
- Publication number 20220275217
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlayer of Sub-structure Having Elevations and Further Sub-struc...
- Publication number 20210335686
- Publication date Oct 28, 2021
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20210167034
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20210118843
- Publication date Apr 22, 2021
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inorganic Encapsulant for Electronic Component with Adhesion Promoter
- Publication number 20200411400
- Publication date Dec 31, 2020
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Providing Coated Leadframes or for Measuring an Adhesion...
- Publication number 20200381314
- Publication date Dec 3, 2020
- INFINEON TECHNOLOGIES AG
- Wu Hu Li
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200243480
- Publication date Jul 30, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Corrosion Protected Mold Compound
- Publication number 20200231800
- Publication date Jul 23, 2020
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Layer Structure, Layer Structure, Method of For...
- Publication number 20200227278
- Publication date Jul 16, 2020
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200219841
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection member with bulk body and electrically and thermally con...
- Publication number 20190131218
- Publication date May 2, 2019
- INFINEON TECHNOLOGIES AG
- Wu Hu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20190035764
- Publication date Jan 31, 2019
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20170323865
- Publication date Nov 9, 2017
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER ALLOYS AND ARRANGEMENTS
- Publication number 20120313230
- Publication date Dec 13, 2012
- INFINEON TECHNOLOGIES AG
- Manfred MENGEL
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING MATERIAL WITH EXOTHERMICALLY REACTIVE HETEROSTRUCTURES
- Publication number 20110127314
- Publication date Jun 2, 2011
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20100059857
- Publication date Mar 11, 2010
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAD-FREE SOFT SOLDER
- Publication number 20090129971
- Publication date May 21, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090108423
- Publication date Apr 30, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Package and Method of Assembling a Semiconductor Package
- Publication number 20090065912
- Publication date Mar 12, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080315423
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...
- Publication number 20080257743
- Publication date Oct 23, 2008
- INFINEON TECHNOLOGIES AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...
- Publication number 20080257744
- Publication date Oct 23, 2008
- INFINEON TECHNOLOGIES AG
- Johannes Lodermeyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Producing a Metal Article Intended for At Least Partiall...
- Publication number 20080194063
- Publication date Aug 14, 2008
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for the Multi-Stage Production of Diffusion Soldered Connect...
- Publication number 20080014460
- Publication date Jan 17, 2008
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Edmund Riedl

Person

Patents Grantslast 30 patents

Inorganic encapsulant for electronic component with adhesion promoter

Soldering a conductor to an aluminum metallization

Method of forming a layer structure, layer structure, method of for...

Chip arrangements

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Metallic interconnect, a method of manufacturing a metallic interco...

Soldering a conductor to an aluminum metallization

Connection member with bulk body and electrically and thermally con...

Solder alloys and arrangements

Method of fabricating a semiconductor device

Semiconductor package and method of assembling a semiconductor package

Bonding material with exothermically reactive heterostructures

Semiconductor device

Method for producing a metal article intended for at least partiall...

Semiconductor package

Method of making an integrated circuit including electrodeposition...

Semiconductor device

Method for the planar joining of components of semiconductor device...

Diffusion soldered semiconductor device

Semiconductor device with semiconductor device components embedded...

Electrically conductive body including an adhesion promoter layer,...

Semiconductor chip arrangement and method

Metal article intended for at least partially coating with a substa...

Diffusion solder position, and process for producing it

Connection device and method for producing the same

Patents Applicationslast 30 patents

CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMEN...

Method of Manufacturing a Package Having an Adhesion Promoter

CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING...

ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...

FILLER PARTICLE HAVING MORPHOLOGICAL ADHESION PROMOTER SHELL ON CORE

Interlayer of Sub-structure Having Elevations and Further Sub-struc...

CHIP ARRANGEMENTS

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

Inorganic Encapsulant for Electronic Component with Adhesion Promoter

Method for Providing Coated Leadframes or for Measuring an Adhesion...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

Corrosion Protected Mold Compound

Method of Forming a Layer Structure, Layer Structure, Method of For...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

Connection member with bulk body and electrically and thermally con...

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

CHIP ARRANGEMENTS

SOLDER ALLOYS AND ARRANGEMENTS

BONDING MATERIAL WITH EXOTHERMICALLY REACTIVE HETEROSTRUCTURES

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

LEAD-FREE SOFT SOLDER

SEMICONDUCTOR PACKAGE

Semiconductor Package and Method of Assembling a Semiconductor Package

SEMICONDUCTOR DEVICE

METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...

METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION...

Method for Producing a Metal Article Intended for At Least Partiall...

Method for the Multi-Stage Production of Diffusion Soldered Connect...