Edmund Sales Cabatbat

Person

Roxas, PH

People

Patents Grantslast 30 patents

Information Patent Grant
High voltage semiconductor package with pin fit leads
- Patent number 11,652,078
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including leads of different lengths
- Patent number 11,417,538
- Issue date Aug 16, 2022
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-branch terminal for integrated circuit (IC) package
- Patent number 10,971,436
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded package with single piece exposed heat slug and leads
- Patent number 10,840,164
- Issue date Nov 17, 2020
- Infineon Technologies AG
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-branch terminal for integrated circuit (IC) package
- Patent number 10,354,943
- Issue date Jul 16, 2019
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat slug and rivet free die attach area
- Patent number 10,083,899
- Issue date Sep 25, 2018
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color yield of white LEDs
- Patent number 9,048,397
- Issue date Jun 2, 2015
- Carsem (M) Sdn. Bhd.
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS
- Publication number 20220336401
- Publication date Oct 20, 2022
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING LEADS OF DIFFERENT LENGTHS
- Publication number 20210366728
- Publication date Nov 25, 2021
- INFINEON TECHNOLOGIES AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BRANCH TERMINAL FOR INTEGRATED CIRCUIT (IC) PACKAGE
- Publication number 20200020618
- Publication date Jan 16, 2020
- INFINEON TECHNOLOGIES AG
- Thomas STOEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonded Package with Single Piece Exposed Heat Slug and Leads
- Publication number 20190355643
- Publication date Nov 21, 2019
- INFINEON TECHNOLOGIES AG
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT SLUG AND RIVET FREE DIE ATTACH AREA
- Publication number 20180211907
- Publication date Jul 26, 2018
- INFINEON TECHNOLOGIES AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLOR YIELD OF WHITE LEDS
- Publication number 20150087087
- Publication date Mar 26, 2015
- CARSEM (M) SDN. BHD.
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS

Edmund Sales Cabatbat

Person

Patents Grantslast 30 patents

High voltage semiconductor package with pin fit leads

Semiconductor package including leads of different lengths

Multi-branch terminal for integrated circuit (IC) package

Wire bonded package with single piece exposed heat slug and leads

Multi-branch terminal for integrated circuit (IC) package

Semiconductor package with heat slug and rivet free die attach area

Color yield of white LEDs

Patents Applicationslast 30 patents

HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS

SEMICONDUCTOR PACKAGE INCLUDING LEADS OF DIFFERENT LENGTHS

MULTI-BRANCH TERMINAL FOR INTEGRATED CIRCUIT (IC) PACKAGE

Wire Bonded Package with Single Piece Exposed Heat Slug and Leads

SEMICONDUCTOR PACKAGE WITH HEAT SLUG AND RIVET FREE DIE ATTACH AREA

COLOR YIELD OF WHITE LEDS