EDUARD J. PABST

Person

MESA, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-mount amplifier devices
- Patent number 12,184,237
- Issue date Dec 31, 2024
- NXP USA, INC.
- Lu Ll
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Amplifier modules with power transistor die and peripheral ground c...
- Patent number 11,990,384
- Issue date May 21, 2024
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected substrate arrays containing electrostatic discharge...
- Patent number 11,329,013
- Issue date May 10, 2022
- NXP USA, INC.
- James Cotronakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency and electromagnetic interference shielding in wafer...
- Patent number 9,589,909
- Issue date Mar 7, 2017
- NXP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages and methods for producing wafer level packages...
- Patent number 9,502,363
- Issue date Nov 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded device packages having antennas and related fabrication me...
- Patent number 9,362,234
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Eduard J. Pabst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having radio frequency stand-off layers
- Patent number 9,343,414
- Issue date May 17, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for the production of microelectronic packages having radio...
- Patent number 9,129,981
- Issue date Sep 8, 2015
- Freescale Semiconductor Inc.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TERMINAL INTERPOSERS WITH MOLD FLOW CHANNELS, CIRCUIT MODULES INCLU...
- Publication number 20240290685
- Publication date Aug 29, 2024
- NXP USA, Inc.
- Eduard Jan Pabst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20240282654
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...
- Publication number 20240120321
- Publication date Apr 11, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT AMPLIFIER DEVICES
- Publication number 20230133034
- Publication date May 4, 2023
- NXP USA, Inc.
- Lu LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC PACKAGE FABRICATION UTILIZING INTERCONNECTED SUBSTR...
- Publication number 20210375797
- Publication date Dec 2, 2021
- NXP USA, Inc.
- James Cotronakis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20210328551
- Publication date Oct 21, 2021
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND...
- Publication number 20150348920
- Publication date Dec 3, 2015
- Freescale Semiconductor Inc.
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...
- Publication number 20150270233
- Publication date Sep 24, 2015
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED DEVICE PACKAGES HAVING ANTENNAS AND RELATED FABRICATION ME...
- Publication number 20150194388
- Publication date Jul 9, 2015
- EDUARD J. PABST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND...
- Publication number 20150145108
- Publication date May 28, 2015
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED DEVICE PACKAGES AND RELATED FABRICATION METHODS
- Publication number 20150108621
- Publication date Apr 23, 2015
- EDUARD J. PABST
- H01 - BASIC ELECTRIC ELEMENTS

EDUARD J. PABST

Person

Patents Grantslast 30 patents

Surface-mount amplifier devices

Amplifier modules with power transistor die and peripheral ground c...

Interconnected substrate arrays containing electrostatic discharge...

Radio frequency and electromagnetic interference shielding in wafer...

Wafer level packages and methods for producing wafer level packages...

Shielded device packages having antennas and related fabrication me...

Microelectronic packages having radio frequency stand-off layers

Methods for the production of microelectronic packages having radio...

Patents Applicationslast 30 patents

TERMINAL INTERPOSERS WITH MOLD FLOW CHANNELS, CIRCUIT MODULES INCLU...

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...

POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...

SURFACE-MOUNT AMPLIFIER DEVICES

MICROELECTRONIC PACKAGE FABRICATION UTILIZING INTERCONNECTED SUBSTR...

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...

MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND...

WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...

SHIELDED DEVICE PACKAGES HAVING ANTENNAS AND RELATED FABRICATION ME...

MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND...

SHIELDED DEVICE PACKAGES AND RELATED FABRICATION METHODS