Eduard KNAUER

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Package with vertically spaced partially encapsulated contact struc...
- Patent number 10,128,165
- Issue date Nov 13, 2018
- Infineon Technologies AG
- Wolfram Hable
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Encapsulated electronic chip device with mounting provision and ext...
- Patent number 9,536,816
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,355,984
- Issue date May 31, 2016
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 7,781,897
- Issue date Aug 24, 2010
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive die attach material
- Patent number 7,667,337
- Issue date Feb 23, 2010
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package with vertically spaced partially encapsulated contact struc...
- Publication number 20180122720
- Publication date May 3, 2018
- INFINEON TECHNOLOGIES AG
- Wolfram HABLE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Encapsulated electronic chip device with mounting provision and ext...
- Publication number 20160035658
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20150021792
- Publication date Jan 22, 2015
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONDUCTIVE DIE ATTACH MATERIAL
- Publication number 20090079088
- Publication date Mar 26, 2009
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with a semiconductor chip stack and plastic ho...
- Publication number 20080067667
- Publication date Mar 20, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20070090539
- Publication date Apr 26, 2007
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS