Eduardo De Mesa

Person

Munich, DE

People

Patents Applicationslast 30 patents

Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR SEMICONDUCTOR DEVICES
- Publication number 20230317620
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
- Publication number 20230317551
- Publication date Oct 5, 2023
- Intel Corporation
- Vishnu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
- Publication number 20230317582
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS BRIDGE FOR CONNECTING DIES
- Publication number 20230317618
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299014
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT...
- Publication number 20230299043
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299012
- Publication date Sep 21, 2023
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299013
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
- Publication number 20230282615
- Publication date Sep 7, 2023
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS

Eduardo De Mesa

Person

Patents Applicationslast 30 patents

THIN CLIENT FORM FACTOR ASSEMBLY

INTERPOSERS FOR SEMICONDUCTOR DEVICES

HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION

GLASS BRIDGE FOR CONNECTING DIES

THREE-DIMENSIONAL STACK COOLING WINGS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

PACKAGING ARCHITECTURE WITH THERMALLY CONDUCTIVE INTEGRATED CIRCUIT...

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER