Eduardo Garcia

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Newburgh, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a crack stop for interlevel dielectric layers
- Patent number 6,174,814
- Issue date Jan 16, 2001
- International Business Machines Corporation
- Robert F. Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having crack stop for interlevel dielectric layers
- Patent number 6,091,131
- Issue date Jul 18, 2000
- International Business Machines Corporation
- Robert F. Cook
- H01 - BASIC ELECTRIC ELEMENTS