Edvin Cetegen

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Open cavity bridge co-planar placement architectures and processes
- Patent number 12,176,268
- Issue date Dec 24, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No mold shelf package design and process flow for advanced package...
- Patent number 12,087,731
- Issue date Sep 10, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding SN substrate features for epoxy flow control
- Patent number 12,009,271
- Issue date Jun 11, 2024
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures for underfill containment
- Patent number 12,002,727
- Issue date Jun 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with thermal insulation
- Patent number 11,942,393
- Issue date Mar 26, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill flow management in electronic assemblies
- Patent number 11,935,861
- Issue date Mar 19, 2024
- Intel Coropration
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No mold shelf package design and process flow for advanced package...
- Patent number 11,901,333
- Issue date Feb 13, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 11,854,945
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor package including a bridge die disposed in...
- Patent number 11,791,274
- Issue date Oct 17, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,776,821
- Issue date Oct 3, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-optimized tunable stack in cavity package-on-package
- Patent number 11,769,753
- Issue date Sep 26, 2023
- Intel Corporation
- George Vakanas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active package cooling structures using molded substrate packaging...
- Patent number 11,735,495
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar Karhade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi-package assemblies having foam structures for warpage control
- Patent number 11,646,274
- Issue date May 9, 2023
- Intel Corporation
- Mufei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal TIM with STIM-like performance with no BSM and BGA com...
- Patent number 11,551,994
- Issue date Jan 10, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual strip backside metallization for improved alt-FLI plating, KOZ...
- Patent number 11,502,008
- Issue date Nov 15, 2022
- Intel Corporation
- Nicholas S. Haehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformable heat sink interface with a high thermal conductivity
- Patent number 11,464,139
- Issue date Oct 4, 2022
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,282,717
- Issue date Mar 22, 2022
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interfaces for integrated circuit packages
- Patent number 10,290,561
- Issue date May 14, 2019
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 10,192,810
- Issue date Jan 29, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to form high density through-mold interconnections
- Patent number 9,741,692
- Issue date Aug 22, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solution for circuit products
- Patent number 9,477,275
- Issue date Oct 25, 2016
- Intel Corporation
- Arnab Choudhury
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Controlling thermal interface material bleed out
- Patent number 8,951,846
- Issue date Feb 10, 2015
- Intel Corporation
- Gopi Krishnan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
- Publication number 20250006691
- Publication date Jan 2, 2025
- Intel Corporation
- George Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20240258183
- Publication date Aug 1, 2024
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPR...
- Publication number 20240213074
- Publication date Jun 27, 2024
- Intel Corporation
- Mark SALTAS
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT
- Publication number 20240186251
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20240136292
- Publication date Apr 25, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20240136326
- Publication date Apr 25, 2024
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20230343723
- Publication date Oct 26, 2023
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20230238355
- Publication date Jul 27, 2023
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20230086180
- Publication date Mar 23, 2023
- Intel Corporation
- Onur Ozkan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having Internal I/O Structures With Modu...
- Publication number 20230086649
- Publication date Mar 23, 2023
- Intel Corporation
- Onur OZKAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20220199536
- Publication date Jun 23, 2022
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
- Publication number 20220165585
- Publication date May 26, 2022
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE
- Publication number 20220102242
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...
- Publication number 20220102231
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391273
- Publication date Dec 16, 2021
- Interl Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391295
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES
- Publication number 20210343677
- Publication date Nov 4, 2021
- Intel Corporation
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES
- Publication number 20210305132
- Publication date Sep 30, 2021
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT
- Publication number 20210249322
- Publication date Aug 12, 2021
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH THERMAL INSULATION
- Publication number 20210242107
- Publication date Aug 5, 2021
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL PACKAGE VAPOR CHAMBER WITH IHS
- Publication number 20210195798
- Publication date Jun 24, 2021
- Intel Corporation
- Nicholas NEAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20210104490
- Publication date Apr 8, 2021
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES
- Publication number 20210066162
- Publication date Mar 4, 2021
- Intel Corporation
- Sergio A. CHAN ARGUEDAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20210035921
- Publication date Feb 4, 2021
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE-THICKNESS INTEGRATED HEAT SPREADER (IHS)
- Publication number 20210028084
- Publication date Jan 28, 2021
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20210020531
- Publication date Jan 21, 2021
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...
- Publication number 20210020532
- Publication date Jan 21, 2021
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PACKAGE ASSEMBLIES HAVING FOAM STRUCTURES FOR WARPAGE CONTROL
- Publication number 20200402920
- Publication date Dec 24, 2020
- Intel Corporation
- Mufei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE
- Publication number 20200273811
- Publication date Aug 27, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS

Edvin Cetegen

Person

Patents Grantslast 30 patents

Open cavity bridge co-planar placement architectures and processes

No mold shelf package design and process flow for advanced package...

Dummy die structures of a packaged integrated circuit device

Protruding SN substrate features for epoxy flow control

Barrier structures for underfill containment

Substrate with thermal insulation

Underfill flow management in electronic assemblies

No mold shelf package design and process flow for advanced package...

Microelectronic structures including bridges

Underfill material flow control for reduced die-to-die spacing in s...

Full package vapor chamber with IHS

Multichip semiconductor package including a bridge die disposed in...

Micro-electronic package with substrate protrusion to facilitate di...

Corner guard for improved electroplated first level interconnect bu...

Thermally-optimized tunable stack in cavity package-on-package

Active package cooling structures using molded substrate packaging...

Multi-package assemblies having foam structures for warpage control

Coupled cooling fins in ultra-small systems

Liquid metal TIM with STIM-like performance with no BSM and BGA com...

Thermal management solutions for integrated circuit packages

Dual strip backside metallization for improved alt-FLI plating, KOZ...

Conformable heat sink interface with a high thermal conductivity

Micro-electronic package with substrate protrusion to facilitate di...

Thermal interfaces for integrated circuit packages

Underfill material flow control for reduced die-to-die spacing in s...

Methods to form high density through-mold interconnections

Thermal management solution for circuit products

Controlling thermal interface material bleed out

Patents Applicationslast 30 patents

COMPLIANT INSERTS FOR PIN DIPPING PROCESSES

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPR...

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION

Semiconductor Chip Package Having Internal I/O Structures With Modu...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...

DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE

DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES

OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES

BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT

SUBSTRATE WITH THERMAL INSULATION

FULL PACKAGE VAPOR CHAMBER WITH IHS

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

VARIABLE-THICKNESS INTEGRATED HEAT SPREADER (IHS)

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...

MULTI-PACKAGE ASSEMBLIES HAVING FOAM STRUCTURES FOR WARPAGE CONTROL

IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE