Edward Andrew Condon

Follow

Person

Sandown, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-level package assembly handling
- Patent number 11,809,441
- Issue date Nov 7, 2023
- Onto Innovation Inc.
- Kevin Barr
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL PACKAGE ASSEMBLY HANDLING
- Publication number 20220121676
- Publication date Apr 21, 2022
- Rudolph Technologies, Inc.
- Kevin Barr
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER-LEVEL PACKAGE ASSEMBLY HANDLING
- Publication number 20220012261
- Publication date Jan 13, 2022
- Rudolph Technologies, Inc.
- Kevin Barr
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER-LEVEL PACKAGE ASSEMBLY HANDLING
- Publication number 20200257699
- Publication date Aug 13, 2020
- Kevin Barr
- G06 - COMPUTING CALCULATING COUNTING