Edward Fuergut

Person

Dasing, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including an embedded semiconductor die
- Patent number 12,002,739
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module including a semiconductor package connected to a...
- Patent number 11,955,407
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with dual integrated heat spreaders
- Patent number 11,929,298
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with connection lug
- Patent number 11,728,250
- Issue date Aug 15, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with signal distribution element
- Patent number 11,721,616
- Issue date Aug 8, 2023
- Infineon Technologies Austria AG
- Stephan Voss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming a semiconductor package
- Patent number 11,715,719
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including electrically insulated load electrodes
- Patent number 11,646,258
- Issue date May 9, 2023
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide device and method for forming a silicon carbide device
- Patent number 11,367,683
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and lead frame design for enhanced creepage and clearance
- Patent number 11,348,866
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic module via compression molding
- Patent number 11,189,542
- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically insulating thermal interface on the discontinuity of a...
- Patent number 11,049,790
- Issue date Jun 29, 2021
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,040,872
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods using an RF circuit on isolating material
- Patent number 10,916,515
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package having a power semiconductor chip
- Patent number 10,734,250
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power package having multiple mold compounds
- Patent number 10,685,909
- Issue date Jun 16, 2020
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing a sheet resistance in an electronic device, and...
- Patent number 10,573,533
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor chip panel
- Patent number 10,483,133
- Issue date Nov 19, 2019
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor module
- Patent number 10,435,292
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic module comprising a plurality of encapsulation layers an...
- Patent number 10,418,313
- Issue date Sep 17, 2019
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having die pads with exposed surfaces
- Patent number 10,373,895
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with improved thermal and electrical performance
- Patent number 10,373,897
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an arrangement including a chip carrier notch
- Patent number 10,361,138
- Issue date Jul 23, 2019
- Infineon Technologies AG
- Michael Ledutke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spatially selective roughening of encapsulant to promote adhesion w...
- Patent number 10,347,554
- Issue date Jul 9, 2019
- Infineon Technologies AG
- Norbert Joson Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor power package
- Patent number 10,256,119
- Issue date Apr 9, 2019
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attaching chip attach medium to already encapsulated electronic chip
- Patent number 10,177,112
- Issue date Jan 8, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON...
- Publication number 20240194566
- Publication date Jun 13, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AT LEAST ONE ELECTRICALLY CONDUCTIVE S...
- Publication number 20230402423
- Publication date Dec 14, 2023
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE WITH DELAMINATION MITIGATION
- Publication number 20230106642
- Publication date Apr 6, 2023
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING...
- Publication number 20230064442
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Chan Whai Augustine KAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Module Comprising Flexible Leads for the Purpo...
- Publication number 20230035550
- Publication date Feb 2, 2023
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Module with Two Different Potting Materials and...
- Publication number 20230014380
- Publication date Jan 19, 2023
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Improved Performance in Operation and Imp...
- Publication number 20220384305
- Publication date Dec 1, 2022
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Connection Lug
- Publication number 20220375830
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Package with Connection Lug
- Publication number 20220375832
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
- Publication number 20220285283
- Publication date Sep 8, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20220157682
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE WITH DUAL INTEGRATED HEAT SPREADERS
- Publication number 20220157686
- Publication date May 19, 2022
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Device Semiconductor Chip with Electrical Access to Devices a...
- Publication number 20220149038
- Publication date May 12, 2022
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE
- Publication number 20220148934
- Publication date May 12, 2022
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE
- Publication number 20220102263
- Publication date Mar 31, 2022
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...
- Publication number 20220102311
- Publication date Mar 31, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising a Thermal Interface Materia...
- Publication number 20220013433
- Publication date Jan 13, 2022
- Infineon Technologies Austria AG
- Martin Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and Lead Frame Design for Enhanced Creepage and Clearance
- Publication number 20210391246
- Publication date Dec 16, 2021
- Infineon Technologies Austria AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Signal Distribution Element
- Publication number 20210384111
- Publication date Dec 9, 2021
- Stephan Voss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE AND A...
- Publication number 20210249334
- Publication date Aug 12, 2021
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Additive Manufacturing of a Frontside or Backside Interconnect of a...
- Publication number 20210225798
- Publication date Jul 22, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A...
- Publication number 20210225734
- Publication date Jul 22, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method
- Publication number 20210066495
- Publication date Mar 4, 2021
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING ELECTRICALLY INSULATED LOAD ELECTRODES
- Publication number 20210043555
- Publication date Feb 11, 2021
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal interface material having defined thermal, mechanical and e...
- Publication number 20210020541
- Publication date Jan 21, 2021
- Infineon Technologies Austria AG
- Christian KASZTELAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming a Semiconductor Package
- Publication number 20200365548
- Publication date Nov 19, 2020
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module Comprising a Semiconductor Package with Integrate...
- Publication number 20200294885
- Publication date Sep 17, 2020
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module with Improved Heat Dissipation and Fabrication Th...
- Publication number 20200266121
- Publication date Aug 20, 2020
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
- Publication number 20200039820
- Publication date Feb 6, 2020
- INFINEON TECHNOLOGIES AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Edward Fuergut

Person

Patents Grantslast 30 patents

Semiconductor device including an embedded semiconductor die

Semiconductor package having a chip carrier with a pad offset feature

Electronic module including a semiconductor package connected to a...

Linear spacer for spacing a carrier of a package

Molded semiconductor package with dual integrated heat spreaders

Package with electrically insulated carrier and at least one step o...

Semiconductor package with connection lug

Semiconductor package with signal distribution element

Semiconductor package and method of forming a semiconductor package

Additive manufacturing of a frontside or backside interconnect of a...

Electronic devices including electrically insulated load electrodes

Silicon carbide device and method for forming a silicon carbide device

Package and lead frame design for enhanced creepage and clearance

Circuit package, an electronic circuit package, and methods for enc...

Method for fabricating an electronic module via compression molding

Electrically insulating thermal interface on the discontinuity of a...

Semiconductor module

Systems and methods using an RF circuit on isolating material

Method of manufacturing a package having a power semiconductor chip

Power package having multiple mold compounds

Method of reducing a sheet resistance in an electronic device, and...

Method for fabricating a semiconductor chip panel

Method for producing a semiconductor module

Electronic module comprising a plurality of encapsulation layers an...

Semiconductor device having die pads with exposed surfaces

Semiconductor devices with improved thermal and electrical performance

Method for manufacturing an arrangement including a chip carrier notch

Spatially selective roughening of encapsulant to promote adhesion w...

Method of manufacturing a semiconductor power package

Attaching chip attach medium to already encapsulated electronic chip

Patents Applicationslast 30 patents

AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR PACKAGE HAVING AT LEAST ONE ELECTRICALLY CONDUCTIVE S...

EMBEDDED PACKAGE WITH DELAMINATION MITIGATION

CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING...

Semiconductor Device Module Comprising Flexible Leads for the Purpo...

Semiconductor Power Module with Two Different Potting Materials and...

Semiconductor Device with Improved Performance in Operation and Imp...

Semiconductor Package with Connection Lug

Method of Forming a Semiconductor Package with Connection Lug

Silicon Carbide Device and Method for Forming a Silicon Carbide Device

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

MOLDED SEMICONDUCTOR PACKAGE WITH DUAL INTEGRATED HEAT SPREADERS

Multi-Device Semiconductor Chip with Electrical Access to Devices a...

LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE

SEMICONDUCTOR DEVICE MODULE HAVING VERTICAL METALLIC CONTACTS AND A...

Semiconductor Device Package Comprising a Thermal Interface Materia...

Package and Lead Frame Design for Enhanced Creepage and Clearance

Semiconductor Package with Signal Distribution Element

SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE AND A...

Additive Manufacturing of a Frontside or Backside Interconnect of a...

ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A...

Power Semiconductor Device and Method

ELECTRONIC DEVICES INCLUDING ELECTRICALLY INSULATED LOAD ELECTRODES

Thermal interface material having defined thermal, mechanical and e...

Semiconductor Package and Method of Forming a Semiconductor Package

Electronic Module Comprising a Semiconductor Package with Integrate...

Electronic Module with Improved Heat Dissipation and Fabrication Th...

METHOD FOR PRODUCING A SEMICONDUCTOR MODULE