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Edward G. Bundga
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Endicott, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Conductive adhesive having a palladium matrix interface between two...
Patent number
6,425,772
Issue date
Jul 30, 2002
International Business Machines Corporation
William E. Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive adhesive having a palladium matrix interface between two...
Patent number
6,331,119
Issue date
Dec 18, 2001
International Business Machines Corporation
William E. Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for connecting cable to the surface of printed...
Patent number
5,281,150
Issue date
Jan 25, 1994
International Business Machines Corporation
Edward G. Bundga
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Conductive adhesive having a palladium matrix interface between two...
Publication number
20020022384
Publication date
Feb 21, 2002
International Business Machines Corporation
William E. Bernier
H01 - BASIC ELECTRIC ELEMENTS