Edward G. Combs

Person

Foster City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an enhanced thermal dissipation integrated...
- Patent number 7,015,072
- Issue date Mar 21, 2006
- ASAT Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit package
- Patent number 6,790,710
- Issue date Sep 14, 2004
- ASAT Limited
- Neil Robert McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal dissipation integrated circuit package
- Patent number 6,734,552
- Issue date May 11, 2004
- ASAT Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded plastic package with heat sink and enhanced electrical perfo...
- Patent number 6,724,071
- Issue date Apr 20, 2004
- ASAT, Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded plastic package with heat sink and enhanced electrical perfo...
- Patent number 6,552,417
- Issue date Apr 22, 2003
- ASAT, Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded plastic package with heat sink and enhanced electrical perfo...
- Patent number 6,326,678
- Issue date Dec 4, 2001
- ASAT, Limited
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a flexible integrated circuit package utili...
- Patent number 6,284,569
- Issue date Sep 4, 2001
- ASAT, Limited
- Robert P. Sheppard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with bonding planes on a ceramic ring us...
- Patent number 6,285,075
- Issue date Sep 4, 2001
- ASAT, Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated carrier ring/stiffener and method for manufacturing a fl...
- Patent number 6,111,324
- Issue date Aug 29, 2000
- Asat, Limited
- Robert P. Sheppard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power dissipation plastic encapsulated package for integrated...
- Patent number 5,596,231
- Issue date Jan 21, 1997
- Asat, Limited
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing enhanced thermal dissipation integrated cir...
- Publication number 20060223237
- Publication date Oct 5, 2006
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package
- Publication number 20050077613
- Publication date Apr 14, 2005
- Neil Robert McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing an enhanced thermal dissipation integrated...
- Publication number 20050003585
- Publication date Jan 6, 2005
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing enhanced thermal dissipation integrated cir...
- Publication number 20040046241
- Publication date Mar 11, 2004
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced thermal dissipation integrated circuit package and method...
- Publication number 20030178719
- Publication date Sep 25, 2003
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated integrated circuit package and method of manufacturing...
- Publication number 20030143781
- Publication date Jul 31, 2003
- Neil Robert McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded plastic package with heat sink and enhanced electrical perfo...
- Publication number 20030038382
- Publication date Feb 27, 2003
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced thermal dissipation integrated circuit package and method...
- Publication number 20030011064
- Publication date Jan 16, 2003
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded plastic package with heat sink and enhanced electrical perfo...
- Publication number 20020074627
- Publication date Jun 20, 2002
- Edward G. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded plastic package with heat sink and enhanced electrical perfo...
- Publication number 20010000924
- Publication date May 10, 2001
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS

Edward G. Combs

Person

Patents Grantslast 30 patents

Method of manufacturing an enhanced thermal dissipation integrated...

Method of manufacturing an integrated circuit package

Enhanced thermal dissipation integrated circuit package

Molded plastic package with heat sink and enhanced electrical perfo...

Molded plastic package with heat sink and enhanced electrical perfo...

Molded plastic package with heat sink and enhanced electrical perfo...

Method of manufacturing a flexible integrated circuit package utili...

Integrated circuit package with bonding planes on a ceramic ring us...

Integrated carrier ring/stiffener and method for manufacturing a fl...

High power dissipation plastic encapsulated package for integrated...

Patents Applicationslast 30 patents

Method of manufacturing enhanced thermal dissipation integrated cir...

Integrated circuit package

Method of manufacturing an enhanced thermal dissipation integrated...

Method of manufacturing enhanced thermal dissipation integrated cir...

Enhanced thermal dissipation integrated circuit package and method...

Encapsulated integrated circuit package and method of manufacturing...

Molded plastic package with heat sink and enhanced electrical perfo...

Enhanced thermal dissipation integrated circuit package and method...

Molded plastic package with heat sink and enhanced electrical perfo...

Molded plastic package with heat sink and enhanced electrical perfo...