Edward Myers

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topside-cooled semiconductor package with molded standoff
- Patent number 11,239,127
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Edward Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,088,105
- Issue date Aug 10, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for an electronic package with a fail-open mechanism
- Patent number 9,082,737
- Issue date Jul 14, 2015
- Infineon Technologies AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF
- Publication number 20210398867
- Publication date Dec 23, 2021
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...
- Publication number 20210358877
- Publication date Nov 18, 2021
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20200168575
- Publication date May 28, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity based feature on chip carrier
- Publication number 20200020649
- Publication date Jan 16, 2020
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method for Fabricating a Semiconductor Device...
- Publication number 20180218992
- Publication date Aug 2, 2018
- INFINEON TECHNOLOGIES AG
- Valerie Vivares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity based feature on chip carrier
- Publication number 20170317036
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Electronic Package with a Fail-Open Mechanism
- Publication number 20140131844
- Publication date May 15, 2014
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS

Edward Myers

Person

Patents Grantslast 30 patents

Semiconductor device having a contact clip with a contact region ha...

Topside-cooled semiconductor package with molded standoff

Semiconductor device and method for fabricating a semiconductor device

System and method for an electronic package with a fail-open mechanism

Patents Applicationslast 30 patents

TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF

SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...

Semiconductor Device and Method for Fabricating a Semiconductor Device

Cavity based feature on chip carrier

Semiconductor Device, Method for Fabricating a Semiconductor Device...

Cavity based feature on chip carrier

System and Method for an Electronic Package with a Fail-Open Mechanism