Edward Prack

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging method and integrated packaging circuit
- Patent number 11,335,664
- Issue date May 17, 2022
- SHENZHEN XlUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging structure and method
- Patent number 11,183,458
- Issue date Nov 23, 2021
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system and packaging method therefor
- Patent number 10,930,634
- Issue date Feb 23, 2021
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging method and integrated packaged circuit
- Patent number 10,867,959
- Issue date Dec 15, 2020
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit multichip stacked packaging structure and method
- Patent number 10,615,151
- Issue date Apr 7, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming joint structures for surface mount packages
- Patent number 10,573,622
- Issue date Feb 25, 2020
- Intel Corporation
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 10,128,225
- Issue date Nov 13, 2018
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of solder and copper interconnect structures and associat...
- Patent number 10,068,863
- Issue date Sep 4, 2018
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 10,049,971
- Issue date Aug 14, 2018
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,824,991
- Issue date Nov 21, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ablation method and recipe for wafer level underfill material patte...
- Patent number 9,786,517
- Issue date Oct 10, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-on-die using water-soluble resist system and method
- Patent number 9,659,889
- Issue date May 23, 2017
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 9,613,934
- Issue date Apr 4, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,583,390
- Issue date Feb 28, 2017
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of solder and copper interconnect structures and associat...
- Patent number 9,508,667
- Issue date Nov 29, 2016
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry-removable protective coatings
- Patent number 9,472,517
- Issue date Oct 18, 2016
- Intel Corporation
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic thin film passivation of metal interconnections
- Patent number 9,257,276
- Issue date Feb 9, 2016
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming die backside coating structures with coreless packages
- Patent number 9,165,914
- Issue date Oct 20, 2015
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 8,987,918
- Issue date Mar 24, 2015
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package and method of manufacturing same
- Patent number 8,674,519
- Issue date Mar 18, 2014
- Intel Corporation
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming die backside coating structures with coreless packages
- Patent number 8,466,559
- Issue date Jun 18, 2013
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process that includes assembling together first and second substrat...
- Patent number 8,404,519
- Issue date Mar 26, 2013
- Intel Corporation
- Gregory M. Chrysler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Polymer thermal interface materials
- Patent number 8,138,239
- Issue date Mar 20, 2012
- Intel Corporation
- Ed Prack
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of interconnecting workpieces
- Patent number 7,971,347
- Issue date Jul 5, 2011
- Intel Corporation
- Leonel Arana
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process of making carbon nanotube array that includes impregnating...
- Patent number 7,964,447
- Issue date Jun 21, 2011
- Intel Corporation
- Gregory M. Chrysler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Article having metal impregnated within carbon nanotube array
- Patent number 7,545,030
- Issue date Jun 9, 2009
- Intel Corporation
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive system for supporting thin silicon wafer
- Patent number 7,462,551
- Issue date Dec 9, 2008
- Intel Corporation
- Sudhakar N. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Packaging Method and Integrated Packaging Circuit
- Publication number 20200043886
- Publication date Feb 6, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit system and packaging method therefor
- Publication number 20200006310
- Publication date Jan 2, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Multichip Stacked Packaging Structure and Method
- Publication number 20190326261
- Publication date Oct 24, 2019
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packaging Method and Integrated Packaged Circuit
- Publication number 20190326207
- Publication date Oct 24, 2019
- Shenzhen Xiuyuan Electronic Technology Co., Ltd.
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packaging Structure and Method
- Publication number 20190287909
- Publication date Sep 19, 2019
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES
- Publication number 20190103377
- Publication date Apr 4, 2019
- Lilia May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20170229438
- Publication date Aug 10, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20170207152
- Publication date Jul 20, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20170141061
- Publication date May 18, 2017
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
- Publication number 20170033069
- Publication date Feb 2, 2017
- Intel Corporation
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20170032991
- Publication date Feb 2, 2017
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...
- Publication number 20170033068
- Publication date Feb 2, 2017
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20160307869
- Publication date Oct 20, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...
- Publication number 20160181217
- Publication date Jun 23, 2016
- Intel Corporation
- Edward R. Prack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20160172222
- Publication date Jun 16, 2016
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20160155667
- Publication date Jun 2, 2016
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
- Publication number 20150270235
- Publication date Sep 24, 2015
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20150187622
- Publication date Jul 2, 2015
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD
- Publication number 20150179595
- Publication date Jun 25, 2015
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20150162313
- Publication date Jun 11, 2015
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...
- Publication number 20150072479
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
- Publication number 20150072515
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20140138818
- Publication date May 22, 2014
- Alexsandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
- Publication number 20130252376
- Publication date Sep 26, 2013
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
- Publication number 20120153494
- Publication date Jun 21, 2012
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120153504
- Publication date Jun 21, 2012
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE AND METAL THERMAL INTERFACE MATERIAL, PROCESS OF MA...
- Publication number 20110214285
- Publication date Sep 8, 2011
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS

Edward Prack

Person

Patents Grantslast 30 patents

Integrated circuit packaging method and integrated packaging circuit

Integrated circuit packaging structure and method

Integrated circuit system and packaging method therefor

Integrated circuit packaging method and integrated packaged circuit

Integrated circuit multichip stacked packaging structure and method

Methods of forming joint structures for surface mount packages

Interconnect structures with polymer core

Formation of solder and copper interconnect structures and associat...

Package structure to enhance yield of TMI interconnections

Laser die backside film removal for integrated circuit (IC) packaging

Organic thin film passivation of metal interconnections

Ablation method and recipe for wafer level underfill material patte...

Solder-on-die using water-soluble resist system and method

Package structure to enhance yield of TMI interconnections

Interconnect structures with polymer core

Organic thin film passivation of metal interconnections

Formation of solder and copper interconnect structures and associat...

Dry-removable protective coatings

Laser die backside film removal for integrated circuit (IC) packaging

Organic thin film passivation of metal interconnections

Forming die backside coating structures with coreless packages

Interconnect structures with polymer core

Microelectronic package and method of manufacturing same

Forming die backside coating structures with coreless packages

Process that includes assembling together first and second substrat...

Polymer thermal interface materials

Method of interconnecting workpieces

Process of making carbon nanotube array that includes impregnating...

Article having metal impregnated within carbon nanotube array

Adhesive system for supporting thin silicon wafer

Patents Applicationslast 30 patents

Integrated Circuit Packaging Method and Integrated Packaging Circuit

Integrated circuit system and packaging method therefor

Integrated Circuit Multichip Stacked Packaging Structure and Method

Integrated Circuit Packaging Method and Integrated Packaged Circuit

Integrated Circuit Packaging Structure and Method

METHODS OF FORMING JOINT STRUCTURES FOR SURFACE MOUNT PACKAGES

INTERCONNECT STRUCTURES WITH POLYMER CORE

Package Structure To Enhance Yield of TMI Interconnections

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

DRY-REMOVABLE PROTECTIVE COATINGS

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

DRY-REMOVABLE PROTECTIVE COATINGS

Package Structure To Enhance Yield of TMI Interconnections

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD

INTERCONNECT STRUCTURES WITH POLYMER CORE

ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...

LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...

INTERCONNECT STRUCTURES WITH POLYMER CORE

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES

FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

CARBON NANOTUBE AND METAL THERMAL INTERFACE MATERIAL, PROCESS OF MA...