Edward Reyes

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for accommodating small minimum die in wire bonded area arra...
- Patent number 6,891,275
- Issue date May 10, 2005
- QUALCOMM Incorporated
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area array package with non-electrically connected solder balls
- Patent number 6,762,495
- Issue date Jul 13, 2004
- QUALCOMM Incorporated
- Edward Reyes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Asymmetric Front/Back Solder Mask
- Publication number 20110195223
- Publication date Aug 11, 2011
- QUALCOMM Incorporated
- Omar J. Bchir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for accommodating small minimum die in wire bonded area arra...
- Publication number 20040195703
- Publication date Oct 7, 2004
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for a accommodating small minimum die in wire bonded area ar...
- Publication number 20040075178
- Publication date Apr 22, 2004
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS