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Edward THEN
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Penang, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Thermal leadless array package with die attach pad locking feature
Patent number
9,196,504
Issue date
Nov 24, 2015
UTAC DONGGUAN LTD.
Albert Loh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capillary underfill and mold encapsulation method and apparatus
Patent number
7,262,077
Issue date
Aug 28, 2007
Intel Corporation
Yin Men Lai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE
Publication number
20140008777
Publication date
Jan 9, 2014
UTAC DONGGUAN LTD
Albert LOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPILLARY UNDERFILL AND MOLD ENCAPSULATION METHOD AND APPARATUS
Publication number
20080017976
Publication date
Jan 24, 2008
Intel Corporation
Yin Men Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Capillary underfill and mold encapsulation method and apparatus
Publication number
20060214311
Publication date
Sep 28, 2006
Yin Men Lai
H01 - BASIC ELECTRIC ELEMENTS