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Edwin L. Tom
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Richardson, TX, US
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last 30 patents
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Patent Grant
Method of breaking and separating a wafer into die using a multi-ra...
Patent number
6,248,648
Issue date
Jun 19, 2001
Texas Instruments Incorporated
Robert G. McKenna
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method and apparatus for breaking and separating a wafer into die u...
Patent number
6,184,063
Issue date
Feb 6, 2001
Texas Instruments Incorporated
Robert G. McKenna
H01 - BASIC ELECTRIC ELEMENTS