Edwin Wai Ming Cheung

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Kowloon, HK

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming lead-free bump interconnections
- Patent number 6,638,847
- Issue date Oct 28, 2003
- Advanced Interconnect Technology Ltd.
- Edwin Wai Ming Cheung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR