EE-Chang Ong

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for reducing IC die mass and thickness while i...
- Patent number 6,534,419
- Issue date Mar 18, 2003
- Advanced Interconnect Solutions
- Ee Chang Ong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for enhancement of a punch guide/receptor tool...
- Patent number 6,269,723
- Issue date Aug 7, 2001
- Integrated Packaging Assembly Corporation
- Ee Chang Ong
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Method for making an IC lead-frame punch
- Patent number 5,497,681
- Issue date Mar 12, 1996
- Integrated Packaging Assembly Corporation
- EE-Chang Ong
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method for sharpening an IC lead-frame punch
- Patent number 5,495,780
- Issue date Mar 5, 1996
- Integrated Packaging Assembly Corporation
- EE-Chang Ong
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Apparatus for integrated circuit lead-frame punching
- Patent number 5,452,635
- Issue date Sep 26, 1995
- Integrated Packaging Assembly Corporation
- EE-Chang Ong
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...