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Ee Hua Wong

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  • Singapore, SG
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR FORMING AND RELEASING INTERCONNECTS
    • Publication number 20090091025
    • Publication date Apr 9, 2009
    • Agency for Science, Technology and Research
    • Ee Hua Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for forming interconnects
    • Publication number 20090078745
    • Publication date Mar 26, 2009
    • Ee Hua Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Micro-Impact Testing Apparatus
    • Publication number 20080141783
    • Publication date Jun 19, 2008
    • Ee Hua Wong
    • G01 - MEASURING TESTING
  • Information Patent Application

    Bend testing apparatus and method of carrying out the same
    • Publication number 20070256503
    • Publication date Nov 8, 2007
    • Agency For Science, Technology and Research
    • Ee Hua Wong
    • G01 - MEASURING TESTING
  • Information Patent Application

    Method and device to elongate a solder joint
    • Publication number 20070114266
    • Publication date May 24, 2007
    • Agency For Science, Technology and Research
    • Ee Hua Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and device to elongate a solder joint
    • Publication number 20050056684
    • Publication date Mar 17, 2005
    • Agency for Science, Technology and Research
    • Ee Hua Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR