Efren Lacap

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Morgan Hill, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Reducing delamination in sensor package
- Patent number 11,584,638
- Issue date Feb 21, 2023
- Invensense, Inc.
- Efren Lacap
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
REDUCING DELAMINATION IN SENSOR PACKAGE.
- Publication number 20220033252
- Publication date Feb 3, 2022
- Efren Lacap
- B81 - MICRO-STRUCTURAL TECHNOLOGY