Efren M. Lacap

Person

Hayward, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lead assembly for a flip-chip power switch
- Patent number 8,942,009
- Issue date Jan 27, 2015
- Volterra Semiconductor LLC
- Efren M. Lacap
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Conductive routings in integrated circuits using under bump metalli...
- Patent number 8,933,520
- Issue date Jan 13, 2015
- Volterra Semiconductor LLC
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip scale package
- Patent number 8,710,664
- Issue date Apr 29, 2014
- Volterra Semiconductor Corporation
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with under bump metallization routing
- Patent number 8,680,676
- Issue date Mar 25, 2014
- Volterra Semiconductor Corporation
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive routings in integrated circuits using under bump metalli...
- Patent number 8,664,767
- Issue date Mar 4, 2014
- Volterra Semiconductor Corporation
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with under bump metallization routing
- Patent number 8,368,212
- Issue date Feb 5, 2013
- Volterra Semiconductor Corporation
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive routings in integrated circuits using under bump metalli...
- Patent number 8,169,081
- Issue date May 1, 2012
- Volterra Semiconductor Corporation
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip scale package
- Patent number 8,106,516
- Issue date Jan 31, 2012
- Volterra Semiconductor Corporation
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead assembly for a flip-chip power switch
- Patent number 8,085,553
- Issue date Dec 27, 2011
- Volterra Semiconductor Corporation
- Efren M. Lacap
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flip chip power switch with under bump metallization stack
- Patent number 7,989,953
- Issue date Aug 2, 2011
- Volterra Semiconductor Corporation
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead Assembly for a Flip-Chip Power Switch
- Publication number 20130037926
- Publication date Feb 14, 2013
- Efren M. Lacap
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER BUMP METALLIZATION ROUTING
- Publication number 20130037933
- Publication date Feb 14, 2013
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ROUTINGS IN INTEGRATED CIRCUITS USING UNDER BUMP METALLI...
- Publication number 20130037963
- Publication date Feb 14, 2013
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Chip Scale Package
- Publication number 20130026638
- Publication date Jan 31, 2013
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer-level chip scale package
- Publication number 20050045697
- Publication date Mar 3, 2005
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Efren M. Lacap

Person

Patents Grantslast 30 patents

Lead assembly for a flip-chip power switch

Conductive routings in integrated circuits using under bump metalli...

Wafer-level chip scale package

Semiconductor package with under bump metallization routing

Conductive routings in integrated circuits using under bump metalli...

Semiconductor package with under bump metallization routing

Conductive routings in integrated circuits using under bump metalli...

Wafer-level chip scale package

Lead assembly for a flip-chip power switch

Flip chip power switch with under bump metallization stack

Patents Applicationslast 30 patents

Lead Assembly for a Flip-Chip Power Switch

SEMICONDUCTOR PACKAGE WITH UNDER BUMP METALLIZATION ROUTING

CONDUCTIVE ROUTINGS IN INTEGRATED CIRCUITS USING UNDER BUMP METALLI...

Wafer-Level Chip Scale Package

Wafer-level chip scale package