Eietsu Hasegawa

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Satte-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of recovering lead-free solder from printed circuit boards
- Patent number 6,705,509
- Issue date Mar 16, 2004
- Senju Metal Industry Co., Ltd.
- Sakari Tada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method using a Cu-containing lead-free alloy
- Patent number 6,474,537
- Issue date Nov 5, 2002
- Senju Metal Industry Co., Ltd.
- Seiichiro Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste for electronic parts
- Patent number 4,740,252
- Issue date Apr 26, 1988
- Senju Metal Industry Co., Ltd.
- Eietsu Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of recovering lead-free solder from printed circuit boards
- Publication number 20030178470
- Publication date Sep 25, 2003
- Sakari Tada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR