Eiichi Ide

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor apparatus
- Patent number 12,132,014
- Issue date Oct 29, 2024
- Hitachi, Ltd.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electric power conversion device, and manufac...
- Patent number 12,095,382
- Issue date Sep 17, 2024
- Hitachi, Ltd.
- Eiichi Ide
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor device
- Patent number 11,967,584
- Issue date Apr 23, 2024
- Hitachi Astemo, Ltd.
- Hiromi Shimazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with heat dissipation plate
- Patent number 10,818,573
- Issue date Oct 27, 2020
- Hitachi Automotive Systems, Ltd.
- Nobutake Tsuyuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter having water passages for cooling power modules
- Patent number 10,701,842
- Issue date Jun 30, 2020
- Hitachi, Ltd.
- Eiichi Ide
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power conversion device
- Patent number 10,194,563
- Issue date Jan 29, 2019
- Hitachi Automotive Systems, Ltd.
- Nobutake Tsuyuno
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Heat-dissipating structure and semiconductor module using same
- Patent number 10,177,069
- Issue date Jan 8, 2019
- Hitachi Ltd.
- Takashi Naito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 10,177,084
- Issue date Jan 8, 2019
- Hitachi, Ltd.
- Nobutake Tsuyuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method for manufacturing the same
- Patent number 10,080,313
- Issue date Sep 18, 2018
- Hitachi, Ltd.
- Hiroshi Shintani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-module device, power conversion device, and method for manufa...
- Patent number 10,064,310
- Issue date Aug 28, 2018
- Hitachi, Ltd.
- Hisashi Tanie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conversion apparatus including wedge inserts
- Patent number 9,870,974
- Issue date Jan 16, 2018
- Hitachi, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof electronic device and manufacturing method thereof
- Patent number 9,852,962
- Issue date Dec 26, 2017
- Hitachi Automotive Systems, Ltd.
- Hiroyuki Temmei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power module
- Patent number 9,591,789
- Issue date Mar 7, 2017
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method for same
- Patent number 9,530,722
- Issue date Dec 27, 2016
- Hitachi Automotive Systems, Ltd.
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 9,439,332
- Issue date Sep 6, 2016
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module and lead frame for power module
- Patent number 9,076,780
- Issue date Jul 7, 2015
- Hitachi, Ltd.
- Yoshinori Negishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 8,952,525
- Issue date Feb 10, 2015
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,912,644
- Issue date Dec 16, 2014
- Hitachi, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and manufacturing method thereof
- Patent number 8,847,374
- Issue date Sep 30, 2014
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding material using metal particle
- Patent number 8,821,768
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,592,996
- Issue date Nov 26, 2013
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding material
- Patent number 8,513,534
- Issue date Aug 20, 2013
- Hitachi, Ltd.
- Toshiaki Morita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electronic member, electronic part and manufacturing method therefor
- Patent number 8,400,777
- Issue date Mar 19, 2013
- Hitachi, Ltd.
- Eiichi Ide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, manufacturing method thereof, composite metal...
- Patent number 8,008,772
- Issue date Aug 30, 2011
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonding material comprising metal particles and bon...
- Patent number 7,955,411
- Issue date Jun 7, 2011
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240282665
- Publication date Aug 22, 2024
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE
- Publication number 20240047231
- Publication date Feb 8, 2024
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Circuit Body, Power Converter, and Electrical Circuit Bo...
- Publication number 20240038611
- Publication date Feb 1, 2024
- Hitachi Astemo, Ltd.
- Ning TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240014088
- Publication date Jan 11, 2024
- Hitachi Power Semiconductor Device, Ltd.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, BUSBAR, AND POWER CONVERTER
- Publication number 20230231487
- Publication date Jul 20, 2023
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Conversion Device and Mechatronic Power Conversion Device
- Publication number 20230059509
- Publication date Feb 23, 2023
- Hitachi Astemo, Ltd.
- Akira MIMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
IN-VEHICLE ELECTRONIC CONTROL DEVICE
- Publication number 20220394881
- Publication date Dec 8, 2022
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF POWER SEMICO...
- Publication number 20220375820
- Publication date Nov 24, 2022
- Hitachi Astemo, Ltd.
- Hiromi SHIMAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS
- Publication number 20220359434
- Publication date Nov 10, 2022
- Hitachi, Ltd
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT BODY, POWER CONVERTER, AND METHOD FOR MANUFACTURIN...
- Publication number 20220336324
- Publication date Oct 20, 2022
- Hitachi Astemo, Ltd.
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND MANUFAC...
- Publication number 20220166337
- Publication date May 26, 2022
- Hitachi, Ltd
- Eiichi IDE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20220013432
- Publication date Jan 13, 2022
- Hitachi Astemo, Ltd.
- Hiromi SHIMAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure
- Publication number 20180254235
- Publication date Sep 6, 2018
- Hitachi Automotive Systems, Ltd.
- NOBUTAKE TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER
- Publication number 20180146577
- Publication date May 24, 2018
- Hitachi, Ltd
- Eiichi IDE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20170338176
- Publication date Nov 23, 2017
- Hitachi, Ltd
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power-Module Device, Power Conversion Device, and Method for Manufa...
- Publication number 20170325360
- Publication date Nov 9, 2017
- HITACHI, LTD.
- Hisashi TANIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME
- Publication number 20170236768
- Publication date Aug 17, 2017
- Hitachi, Ltd
- Takashi NAITO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20170223875
- Publication date Aug 3, 2017
- Hitachi Automotive Systems, Ltd.
- NOBUTAKE TSUYUNO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power-Module Device and Power Conversion Device
- Publication number 20170084515
- Publication date Mar 23, 2017
- Hitachi, Ltd
- Hiroshi SHINTANI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power Conversion Apparatus
- Publication number 20170069562
- Publication date Mar 9, 2017
- Hitachi, Ltd
- Eiichi IDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waterproof Electronic Device and Manufacturing Method Thereof
- Publication number 20160343636
- Publication date Nov 24, 2016
- Hitachi Automotive Systems, Ltd.
- Hiroyuki TEMMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160322281
- Publication date Nov 3, 2016
- Hitachi, Ltd
- Hiroshi SHINTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Production Method for Same
- Publication number 20150294927
- Publication date Oct 15, 2015
- Hitachi Automotive Systems ,Ltd.
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Power Module
- Publication number 20150003019
- Publication date Jan 1, 2015
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Module and Method for Manufacturing Semiconductor Module
- Publication number 20140197532
- Publication date Jul 17, 2014
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module
- Publication number 20140168901
- Publication date Jun 19, 2014
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130299962
- Publication date Nov 14, 2013
- Hitachi, Ltd
- Eiichi IDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND LEAD FRAME FOR POWER MODULE
- Publication number 20130270684
- Publication date Oct 17, 2013
- Hitachi, Ltd
- Yoshinori Negishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Manufacturing Method Thereof
- Publication number 20130175678
- Publication date Jul 11, 2013
- Hitachi Automotive Systems, Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
- Publication number 20130119322
- Publication date May 16, 2013
- Hitachi Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Power semiconductor apparatus

Semiconductor device, electric power conversion device, and manufac...

Power semiconductor device

Power semiconductor module with heat dissipation plate

Power converter having water passages for cooling power modules

Power conversion device

Heat-dissipating structure and semiconductor module using same

Semiconductor module and method of manufacturing semiconductor module

Power module and method for manufacturing the same

Power-module device, power conversion device, and method for manufa...

Power conversion apparatus including wedge inserts

Waterproof electronic device and manufacturing method thereof

Power semiconductor module and power module

Semiconductor device and production method for same

Power module

Power module and lead frame for power module

Semiconductor module and method for manufacturing semiconductor module

Semiconductor device and method for manufacturing same

Power semiconductor module and manufacturing method thereof

Electrically conductive bonding material, method of bonding with th...

Low temperature bonding material comprising coated metal nanopartic...

Bonding method and bonding material using metal particle

Semiconductor device and method of manufacturing the same

Semiconductor device and bonding material

Electronic member, electronic part and manufacturing method therefor

Semiconductor device, manufacturing method thereof, composite metal...

Low temperature bonding material comprising metal particles and bon...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE

ELECTRIC CIRCUIT BODY AND POWER CONVERSION DEVICE

Electrical Circuit Body, Power Converter, and Electrical Circuit Bo...

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, BUSBAR, AND POWER CONVERTER

Power Conversion Device and Mechatronic Power Conversion Device

IN-VEHICLE ELECTRONIC CONTROL DEVICE

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF POWER SEMICO...

POWER SEMICONDUCTOR APPARATUS

ELECTRIC CIRCUIT BODY, POWER CONVERTER, AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND MANUFAC...

POWER SEMICONDUCTOR DEVICE

Structure

POWER CONVERTER

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

Power-Module Device, Power Conversion Device, and Method for Manufa...

HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME

POWER CONVERSION DEVICE

Power-Module Device and Power Conversion Device

Power Conversion Apparatus

Waterproof Electronic Device and Manufacturing Method Thereof

POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Production Method for Same

Power Semiconductor Module and Power Module

Semiconductor Module and Method for Manufacturing Semiconductor Module

Power Module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

POWER MODULE AND LEAD FRAME FOR POWER MODULE

Power Semiconductor Module and Manufacturing Method Thereof

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION