Eiichi Nakano

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for direct bonding in semiconductor die manufac...
- Patent number 12,237,299
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 12,051,670
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of GPU-HBM package by microchannel integrated su...
- Patent number 11,915,997
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with carbon-based conductive regions an...
- Patent number 11,881,468
- Issue date Jan 23, 2024
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for direct bonding in semiconductor die manufac...
- Patent number 11,817,420
- Issue date Nov 14, 2023
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 11,749,608
- Issue date Sep 5, 2023
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-scale memory techniques
- Patent number 11,621,257
- Issue date Apr 4, 2023
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for fabricating 3D semiconductor device packages, resulting...
- Patent number 11,456,278
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods...
- Patent number 11,410,973
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice assemblies, packages and systems, and methods of...
- Patent number 11,380,665
- Issue date Jul 5, 2022
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with carbon-based conductive regions an...
- Patent number 11,189,588
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,171,118
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 11,139,262
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having electrically and optically conductive...
- Patent number 11,069,612
- Issue date Jul 20, 2021
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flexible circuit for enabling non-destruc...
- Patent number 10,943,860
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers with carbon-based conductive elements, method...
- Patent number 10,854,549
- Issue date Dec 1, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating 3D semiconductor device packages, resulting...
- Patent number 10,797,018
- Issue date Oct 6, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and structures
- Patent number 10,651,050
- Issue date May 12, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice assemblies, packages and systems, and methods of...
- Patent number 10,600,770
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer with fuse-selectable routing array
- Patent number 10,580,720
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having electrically and optically conductive...
- Patent number 10,529,659
- Issue date Jan 7, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies including inductors and associated methods
- Patent number 10,446,527
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and related methods
- Patent number 10,418,255
- Issue date Sep 17, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating 3D semiconductor device packages, resulting...
- Patent number 10,319,696
- Issue date Jun 11, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flexible circuit for enabling non-destruc...
- Patent number 10,276,487
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies including inductors and associated methods
- Patent number 10,217,726
- Issue date Feb 26, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies including inductors and associated methods
- Patent number 10,177,120
- Issue date Jan 8, 2019
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having electrically and optically conductive...
- Patent number 10,141,259
- Issue date Nov 27, 2018
- Micron Technology, Inc.
- Eiichi Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20240387441
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PATH SIGNAL AMPLIFICATION IN COUPLED SEMICONDUCTOR SYSTEMS
- Publication number 20240355371
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- James Brian Johnson
- G11 - INFORMATION STORAGE
Information Patent Application
TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS
- Publication number 20240313098
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- James Brian Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY
- Publication number 20240237363
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- James Brian Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...
- Publication number 20240203827
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR TECHNIQUES FOR COUPLED MEMORY DIES
- Publication number 20240194287
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- James Brian Johnson
- G11 - INFORMATION STORAGE
Information Patent Application
TECHNIQUES FOR THERMAL DISTRIBUTION IN COUPLED SEMICONDUCTOR SYSTEMS
- Publication number 20240186274
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Amy Rae Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR COUPLED HOST AND MEMORY DIES
- Publication number 20240176523
- Publication date May 30, 2024
- Micron Technology, Inc.
- James Brian Johnson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
- Publication number 20240170435
- Publication date May 23, 2024
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY WITH PARALLEL MAIN AND TEST INTERFACES
- Publication number 20240071556
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- James Brian Johnson
- G11 - INFORMATION STORAGE
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20240063172
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...
- Publication number 20230411299
- Publication date Dec 21, 2023
- Lodestar Licensing Group, LLC
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
- Publication number 20230395545
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER COATED SEMICONDUCTOR DEVICES AND HYBRID BONDING TO FORM SEM...
- Publication number 20230065248
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT FOR STACKED WAFERS AND SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20230065325
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Shiro Uchiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230020037
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20220375902
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
- Publication number 20220077098
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...
- Publication number 20220059508
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20220028820
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...
- Publication number 20210407889
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT MATERIALS FOR SEMICONDUCTOR DEVICES, AND ASSOCIA...
- Publication number 20210272872
- Publication date Sep 2, 2021
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-SCALE MEMORY TECHNIQUES
- Publication number 20210240344
- Publication date Aug 5, 2021
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20210118852
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...
- Publication number 20210057342
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...
- Publication number 20210005575
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING 3D SEMICONDUCTOR DEVICE PACKAGES, RESULTING...
- Publication number 20200266173
- Publication date Aug 20, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of Pre-Channeled Materials for Anisotropic Conductors
- Publication number 20200258859
- Publication date Aug 13, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS WITH CARBON-BASED CONDUCTIVE ELEMENTS, METHOD...
- Publication number 20200211967
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
- Publication number 20200211996
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS

Eiichi Nakano

Person

Patents Grantslast 30 patents

Systems and methods for direct bonding in semiconductor die manufac...

Methods of forming microelectronic device assemblies and packages

Use of pre-channeled materials for anisotropic conductors

Thermal management of GPU-HBM package by microchannel integrated su...

Anisotropic conductive film with carbon-based conductive regions an...

Systems and methods for direct bonding in semiconductor die manufac...

Semiconductor assemblies including thermal circuits and methods of...

Device packages including redistribution layers with carbon-based c...

Wafer-scale memory techniques

Methods for fabricating 3D semiconductor device packages, resulting...

Microelectronic device assemblies and packages and related methods...

Semiconductor dice assemblies, packages and systems, and methods of...

Anisotropic conductive film with carbon-based conductive regions an...

Semiconductor assemblies including thermal circuits and methods of...

Use of pre-channeled materials for anisotropic conductors

Semiconductor devices having electrically and optically conductive...

Semiconductor device with flexible circuit for enabling non-destruc...

Redistribution layers with carbon-based conductive elements, method...

Methods for fabricating 3D semiconductor device packages, resulting...

Semiconductor device packages and structures

Semiconductor dice assemblies, packages and systems, and methods of...

Silicon interposer with fuse-selectable routing array

Semiconductor devices having electrically and optically conductive...

Stacked semiconductor dies including inductors and associated methods

Semiconductor device packages and related methods

Methods for fabricating 3D semiconductor device packages, resulting...

Semiconductor device with flexible circuit for enabling non-destruc...

Stacked semiconductor dies including inductors and associated methods

Stacked semiconductor dies including inductors and associated methods

Semiconductor devices having electrically and optically conductive...

Patents Applicationslast 30 patents

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

DATA PATH SIGNAL AMPLIFICATION IN COUPLED SEMICONDUCTOR SYSTEMS

TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS

TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY

THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...

REPAIR TECHNIQUES FOR COUPLED MEMORY DIES

TECHNIQUES FOR THERMAL DISTRIBUTION IN COUPLED SEMICONDUCTOR SYSTEMS

TECHNIQUES FOR COUPLED HOST AND MEMORY DIES

ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...

MEMORY WITH PARALLEL MAIN AND TEST INTERFACES

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...

MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...

POLYMER COATED SEMICONDUCTOR DEVICES AND HYBRID BONDING TO FORM SEM...

WAFER ALIGNMENT FOR STACKED WAFERS AND SEMICONDUCTOR DEVICE ASSEMBLIES

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...

THERMAL MANAGEMENT MATERIALS FOR SEMICONDUCTOR DEVICES, AND ASSOCIA...

WAFER-SCALE MEMORY TECHNIQUES

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

DEVICE PACKAGES INCLUDING REDISTRIBUTION LAYERS WITH CARBON-BASED C...

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...

METHODS FOR FABRICATING 3D SEMICONDUCTOR DEVICE PACKAGES, RESULTING...

Use of Pre-Channeled Materials for Anisotropic Conductors

REDISTRIBUTION LAYERS WITH CARBON-BASED CONDUCTIVE ELEMENTS, METHOD...

ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...