Eiichi NOMURA

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Tatsuno-shi, Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer sheet for mold underfill encapsulation, method for mold...
- Patent number 12,362,310
- Issue date Jul 15, 2025
- Nagase Chemtex Corporation
- Daisuke Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable resin composition and curable sheet
- Patent number 11,718,770
- Issue date Aug 8, 2023
- Nagase Chemtex Corporation
- Takayuki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,710,645
- Issue date Jul 25, 2023
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting structure
- Patent number 11,315,804
- Issue date Apr 26, 2022
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
- Publication number 20220310546
- Publication date Sep 29, 2022
- NAGASE CHEMTEX CORPORATION
- Daisuke MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN COMPOSITION AND CURABLE SHEET
- Publication number 20210403765
- Publication date Dec 30, 2021
- Nagase Chemtex Corporation
- Takayuki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND SHEET THEREFOR
- Publication number 20210084775
- Publication date Mar 18, 2021
- Nagase Chemtex Corporation
- Eiichi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MOUNTING STRUCTURE
- Publication number 20200388509
- Publication date Dec 10, 2020
- NAGASE CHEMTEX CORPORATION
- Eiichi NOMURA
- H03 - BASIC ELECTRONIC CIRCUITRY