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Eiichi Ogawa
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Kanagawa, JP
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last 30 patents
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Patent Grant
Method of bonding circuit boards
Patent number
5,545,281
Issue date
Aug 13, 1996
NEC Corporation
Koji Matsui
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of bonding circuit boards
Patent number
5,318,651
Issue date
Jun 7, 1994
NEC Corporation
Koji Matsui
H01 - BASIC ELECTRIC ELEMENTS