Eiichi Okuno

Person

Gifu-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Verification terminal and verification system
- Patent number 11,431,474
- Issue date Aug 30, 2022
- Denso Corporation
- Tatsuya Okabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Verification terminal
- Patent number 11,374,942
- Issue date Jun 28, 2022
- Denso Corporation
- Tatsuya Okabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wakefulness maintenance apparatus
- Patent number 10,864,922
- Issue date Dec 15, 2020
- Denso Corporation
- Satori Hachisuka
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multisensory interface control method, multisensory interface contr...
- Patent number 10,563,997
- Issue date Feb 18, 2020
- DENSO CORPORATION
- Ryo Kyung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Composite heat storage material
- Patent number 10,155,895
- Issue date Dec 18, 2018
- Denso Corporation
- Shinya Kasamatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat storage unit and heat storage system
- Patent number 10,126,072
- Issue date Nov 13, 2018
- Denso Corporation
- Shinya Kasamatsu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Antenna device and high-frequency transmitter
- Patent number 9,998,196
- Issue date Jun 12, 2018
- Denso Corporation
- Koutarou Mizunuma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermionic converter
- Patent number 8,970,088
- Issue date Mar 3, 2015
- Denso Corporation
- Yuji Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC single crystal substrate, SiC single crystal epitaxial wafer, a...
- Patent number 8,470,091
- Issue date Jun 25, 2013
- Denso Corporation
- Yasuo Kitou
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silicon carbide semiconductor device with Schottky barrier diode an...
- Patent number 8,324,704
- Issue date Dec 4, 2012
- Denso Corporation
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device including deep layer
- Patent number 8,193,564
- Issue date Jun 5, 2012
- Denso Corporation
- Naohiro Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device making method
- Patent number 8,168,485
- Issue date May 1, 2012
- Denso Corporation
- Takeshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 8,164,100
- Issue date Apr 24, 2012
- Toyota Jidosha Kabushiki Kaisha
- Hirokazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and manufacturing method of th...
- Patent number 8,154,074
- Issue date Apr 10, 2012
- Denso Corporation
- Kensaku Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing silicon carbide semiconductor device havin...
- Patent number 7,993,966
- Issue date Aug 9, 2011
- Denso Corporation
- Takeshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device including deep layer
- Patent number 7,994,513
- Issue date Aug 9, 2011
- Denso Corporation
- Kensaku Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device
- Patent number 7,968,892
- Issue date Jun 28, 2011
- Denso Corporation
- Jun Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making silicon carbide semiconductor device
- Patent number 7,947,555
- Issue date May 24, 2011
- Denso Corporation
- Atsuya Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC semiconductor device having outer periphery structure
- Patent number 7,915,705
- Issue date Mar 29, 2011
- Denso Corporation
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having junction barrier Schott...
- Patent number 7,893,467
- Issue date Feb 22, 2011
- Denso Corporation
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SIC semiconductor having junction barrier Schottky diode
- Patent number 7,863,682
- Issue date Jan 4, 2011
- Denso Corporation
- Eiichi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and method of manufacturing th...
- Patent number 7,855,412
- Issue date Dec 21, 2010
- Denso Corporation
- Hideo Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 7,855,131
- Issue date Dec 21, 2010
- Toyota Jidosha Kabushiki Kaisha
- Hirokazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having junction barrier schott...
- Patent number 7,851,882
- Issue date Dec 14, 2010
- Denso Corporation
- Eiichi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC semiconductor device having bottom layer and method for manufac...
- Patent number 7,851,854
- Issue date Dec 14, 2010
- Denso Corporation
- Eiichi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silcon carbide semiconductor device having schottky barrier diode a...
- Patent number 7,838,888
- Issue date Nov 23, 2010
- Denso Corporation
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making silicon carbide semiconductor device having multi-...
- Patent number 7,825,017
- Issue date Nov 2, 2010
- Denso Corporation
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and related manufacturing method
- Patent number 7,825,449
- Issue date Nov 2, 2010
- Denso Corporation
- Naohiro Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC semiconductor device and method for manufacturing the same
- Patent number 7,824,995
- Issue date Nov 2, 2010
- Denso Corporation
- Takeshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC semiconductor having junction barrier schottky device
- Patent number 7,816,733
- Issue date Oct 19, 2010
- Denso Corporation
- Eiichi Okuno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAKEFULNESS MAINTENANCE APPARATUS
- Publication number 20200017125
- Publication date Jan 16, 2020
- DENSO CORPORATION
- Satori HACHISUKA
- B60 - VEHICLES IN GENERAL
Information Patent Application
VERIFICATION TERMINAL AND VERIFICATION SYSTEM
- Publication number 20190273606
- Publication date Sep 5, 2019
- DENSO CORPORATION
- Tatsuya OKABE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VERIFICATION TERMINAL
- Publication number 20190260763
- Publication date Aug 22, 2019
- DENSO CORPORATION
- Tatsuya OKABE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTENNA DEVICE AND HIGH-FREQUENCY TRANSMITTER
- Publication number 20170353225
- Publication date Dec 7, 2017
- Denso Corporation
- Koutarou MIZUNUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RISK PREDICTION DEVICE AND DRIVING SUPPORT SYSTEM
- Publication number 20170323568
- Publication date Nov 9, 2017
- Denso Corporation
- Naoya Inoue
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTISENSORY INTERFACE CONTROL METHOD, MULTISENSORY INTERFACE CONTR...
- Publication number 20170314951
- Publication date Nov 2, 2017
- Denso Corporation
- Ryo Kyung Lee
- G02 - OPTICS
Information Patent Application
COMPOSITE HEAT STORAGE MATERIAL
- Publication number 20170298262
- Publication date Oct 19, 2017
- Denso Corporation
- Shinya KASAMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT STORAGE UNIT AND HEAT STORAGE SYSTEM
- Publication number 20170276436
- Publication date Sep 28, 2017
- Denso Corporation
- Shinya KASAMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMIONIC CONVERTER
- Publication number 20110139205
- Publication date Jun 16, 2011
- DENSO CORPORATION
- Yuji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermionic converter
- Publication number 20110017253
- Publication date Jan 27, 2011
- DENSO CORPORATION
- Mitsuhiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device with schottky barrier diode an...
- Publication number 20100244049
- Publication date Sep 30, 2010
- DENSO CORPORATION
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC single crystal substrate, SiC single crystal epitaxial wafer, a...
- Publication number 20100200866
- Publication date Aug 12, 2010
- DENSO CORPORATION
- Yasuo Kitou
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor device and method of making the same
- Publication number 20100032730
- Publication date Feb 11, 2010
- DENSO CORPORATION
- Takeshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device and manufacturing method of th...
- Publication number 20100006861
- Publication date Jan 14, 2010
- DENSO CORPORATION
- Kensaku Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing silicon carbide semicondutor device having...
- Publication number 20090311839
- Publication date Dec 17, 2009
- DENSO CORPORATION
- Shinichirou Miyahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device and method of manufacturing th...
- Publication number 20090289264
- Publication date Nov 26, 2009
- DENSO CORPORATION
- Hideo Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making silicon carbide semiconductor device
- Publication number 20090280609
- Publication date Nov 12, 2009
- DENSO CORPORATION
- Atsuya Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a semiconductor device
- Publication number 20090269908
- Publication date Oct 29, 2009
- Toyota Jidosha Kabushiki Kaisha
- Hirokazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20090267082
- Publication date Oct 29, 2009
- DENSO CORPORATION
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device including deep layer
- Publication number 20090261350
- Publication date Oct 22, 2009
- DENSO CORPORATION
- Kensaku Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20090236611
- Publication date Sep 24, 2009
- DENSO CORPORATION
- Takeo YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device including deep layer
- Publication number 20090200559
- Publication date Aug 13, 2009
- DENSO CORPORATION
- Naohiro Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC semiconductor device having bottom layer and method for manufac...
- Publication number 20090166730
- Publication date Jul 2, 2009
- DENSO CORPORATION
- Eiichi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090160008
- Publication date Jun 25, 2009
- Hirokazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20090159898
- Publication date Jun 25, 2009
- Hirokazu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device and related manufacturing method
- Publication number 20090114969
- Publication date May 7, 2009
- DENSO CORPORATION
- Naohiro Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device
- Publication number 20090090920
- Publication date Apr 9, 2009
- DENSO CORPORATION
- Takeshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device including silicon carb...
- Publication number 20090011598
- Publication date Jan 8, 2009
- DENSO CORPORATION
- Masanori Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device having junction barrier schott...
- Publication number 20090008651
- Publication date Jan 8, 2009
- DENSO CORPORATION
- Eiichi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device having junction barrier schott...
- Publication number 20080296587
- Publication date Dec 4, 2008
- DENSO CORPORATION
- Takeo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Eiichi Okuno

Person

Patents Grantslast 30 patents

Verification terminal and verification system

Verification terminal

Wakefulness maintenance apparatus

Multisensory interface control method, multisensory interface contr...

Composite heat storage material

Heat storage unit and heat storage system

Antenna device and high-frequency transmitter

Thermionic converter

SiC single crystal substrate, SiC single crystal epitaxial wafer, a...

Silicon carbide semiconductor device with Schottky barrier diode an...

Silicon carbide semiconductor device including deep layer

Semiconductor device making method

Semiconductor device and method of manufacturing thereof

Silicon carbide semiconductor device and manufacturing method of th...

Method for manufacturing silicon carbide semiconductor device havin...

Silicon carbide semiconductor device including deep layer

Silicon carbide semiconductor device

Method of making silicon carbide semiconductor device

SiC semiconductor device having outer periphery structure

Silicon carbide semiconductor device having junction barrier Schott...

SIC semiconductor having junction barrier Schottky diode

Silicon carbide semiconductor device and method of manufacturing th...

Manufacturing method of a semiconductor device

Silicon carbide semiconductor device having junction barrier schott...

SiC semiconductor device having bottom layer and method for manufac...

Silcon carbide semiconductor device having schottky barrier diode a...

Method of making silicon carbide semiconductor device having multi-...

Silicon carbide semiconductor device and related manufacturing method

SiC semiconductor device and method for manufacturing the same

SiC semiconductor having junction barrier schottky device

Patents Applicationslast 30 patents

WAKEFULNESS MAINTENANCE APPARATUS

VERIFICATION TERMINAL AND VERIFICATION SYSTEM

VERIFICATION TERMINAL

ANTENNA DEVICE AND HIGH-FREQUENCY TRANSMITTER

RISK PREDICTION DEVICE AND DRIVING SUPPORT SYSTEM

MULTISENSORY INTERFACE CONTROL METHOD, MULTISENSORY INTERFACE CONTR...

COMPOSITE HEAT STORAGE MATERIAL

HEAT STORAGE UNIT AND HEAT STORAGE SYSTEM

THERMIONIC CONVERTER

Thermionic converter

Silicon carbide semiconductor device with schottky barrier diode an...

SiC single crystal substrate, SiC single crystal epitaxial wafer, a...

Semiconductor device and method of making the same

Silicon carbide semiconductor device and manufacturing method of th...

Method for manufacturing silicon carbide semicondutor device having...

Silicon carbide semiconductor device and method of manufacturing th...

Method of making silicon carbide semiconductor device

Manufacturing method of a semiconductor device

Semiconductor device and manufacturing method of the same

Silicon carbide semiconductor device including deep layer

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

Silicon carbide semiconductor device including deep layer

SiC semiconductor device having bottom layer and method for manufac...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Silicon carbide semiconductor device and related manufacturing method

Silicon carbide semiconductor device

Method of manufacturing semiconductor device including silicon carb...

Silicon carbide semiconductor device having junction barrier schott...

Silicon carbide semiconductor device having junction barrier schott...