Eiichi Omura

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Nara-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation structure of semiconductor device
- Patent number 9,997,430
- Issue date Jun 12, 2018
- Omron Corporation
- Eiichi Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupler having first and second terminal boards and first a...
- Patent number 8,410,464
- Issue date Apr 2, 2013
- Omron Corporation
- Eiichi Omura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Acoustic sensor
- Patent number 8,300,857
- Issue date Oct 30, 2012
- Omron Corporation
- Eiichi Omura
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20170301602
- Publication date Oct 19, 2017
- Omron Corporation
- Eiichi Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC SENSOR
- Publication number 20110204745
- Publication date Aug 25, 2011
- Omron Corporation
- Eiichi Omura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL COUPLER
- Publication number 20100270483
- Publication date Oct 28, 2010
- Omron Corporation
- Eiichi Omura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE