Eiichi Shimazaki

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Kokubunji, JP

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus
- Patent number 6,244,493
- Issue date Jun 12, 2001
- Kabushiki Kaisha Shinkawa
- Eiichi Shimazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame separating and conveying apparatus
- Patent number 6,003,655
- Issue date Dec 21, 1999
- Kabushiki Kaisha Shinkawa
- Yuji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS