Eiichi Soda

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming interconnects in semiconductor device
- Patent number 6,391,772
- Issue date May 21, 2002
- NEC Corporation
- Ken Tokashiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,103,631
- Issue date Aug 15, 2000
- NEC Corporation
- Eiichi Soda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing semiconductor device including two-step as...
- Publication number 20030054656
- Publication date Mar 20, 2003
- NEC Corporation
- Eiichi Soda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20020119677
- Publication date Aug 29, 2002
- Eiichi Soda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20010036728
- Publication date Nov 1, 2001
- NEC Corporation
- Toshiki Shinmura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...