Eiji Hagimoto

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Chip package device mountable on a mother board in whichever of fac...
- Patent number 5,969,417
- Issue date Oct 19, 1999
- NEC Corporation
- Koji Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package device mountable on a mother board in whichever of fac...
- Patent number 5,909,055
- Issue date Jun 1, 1999
- NEC Corporation
- Koji Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bump leaded film carrier type semiconducto...
- Patent number 5,905,303
- Issue date May 18, 1999
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bump leaded film carrier type semiconducto...
- Patent number 5,683,942
- Issue date Nov 4, 1997
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS