Eiji Hirata

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Isesaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a multilayer printed wiring board
- Patent number 7,363,706
- Issue date Apr 29, 2008
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 7,243,425
- Issue date Jul 17, 2007
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Printed-wiring board, multilayer printed-wiring board and manufactu...
- Publication number 20070074902
- Publication date Apr 5, 2007
- CMK CORPORATION
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20060137906
- Publication date Jun 29, 2006
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and method of manufacturing the same
- Publication number 20060137904
- Publication date Jun 29, 2006
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR