Eiji Hori

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding sheet, electronic circuit device and its manufacturing method
- Patent number 8,822,836
- Issue date Sep 2, 2014
- NEC Corporation
- Eiji Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING SHEET, ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20100071945
- Publication date Mar 25, 2010
- EIJI HORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090102048
- Publication date Apr 23, 2009
- Eiji Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD...
- Publication number 20080224309
- Publication date Sep 18, 2008
- NEC Corporation
- Eiji Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Face down type semiconductor device and manufacturing process of fa...
- Publication number 20070152347
- Publication date Jul 5, 2007
- NEC Corporation
- Eiji Hori
- H01 - BASIC ELECTRIC ELEMENTS