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Eiji Horikoshi
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Isehara, JP
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last 30 patents
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Patent Grant
Photosensitive, heat-resistant resin composition for forming patterns
Patent number
6,045,975
Issue date
Apr 4, 2000
Fujitsu Limited
Motoaki Tani
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Process for using photosensitive, heat-resistant resin composition...
Patent number
6,013,419
Issue date
Jan 11, 2000
Fujitsu Limited
Motoaki Tani
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Photosensitive, heat-resistant resin composition and process for us...
Patent number
5,972,807
Issue date
Oct 26, 1999
Fujitsu Limited
Motaki Tani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board and process for producing same
Patent number
5,362,359
Issue date
Nov 8, 1994
Fujitsu Limited
Eiji Horikoshi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Via hole structure and process for formation thereof
Patent number
5,308,929
Issue date
May 3, 1994
Fujitsu Limited
Motoaki Tani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board and process for producing same
Patent number
5,236,772
Issue date
Aug 17, 1993
Fujitsu Limited
Eiji Horikoshi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Sintered magnesium-based composite material and process for prepari...
Patent number
4,941,918
Issue date
Jul 17, 1990
Fujitsu Limited
Eiji Horikoshi
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...